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An array of accelerated temperature cycling (ATC) finite element (FE) simulations using ANSYStrade, and drop-impact finite element simulations using LS DYNAtrade, are used to find the optimum elastic modulus and coefficient of thermal expansion (CTE) for a stacked chip scale package. For the ATC simulations, Anand's constitutive model with properties for Sn96.5Ag3.0Cu0.5 (SAC305) and tin-lead eutectic...
Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are more extreme. This can occur during assembly with lead free solders, packages that generate heat due to their small size and processing power and applications where the package is in proximity to high temperatures...
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