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In this work we present our recent investigation on characterizing mechanical properties of porous silicon (PS) by using instrumented micro-indentation. Hardness and elastic modulus for oxidized and nonoxidized PS were measured. Experimental results revealed that hardness and elastic modulus are significantly lower than that of silicon substrate and decrease with increasing porosities. After oxidation...
This paper presents characteristics of Fe-B-Nb-Nd magnetic metallic glass thin film (MGTF) which is greatly desired for MEMS/NEMS devices. The advantages of the Fe-B-Nb-Nd MGTF include high robustness and soft magnetic property. In our study, we have measured the film characteristics such as structure, surface morphology, hardness, elastic modulus, internal stress, and soft magnetic property. We also...
The thermal stress induced by the coefficient of thermal expansion mismatch between a silicon integrated circuit and an organic substrate is an important reliability issue for chip-to-substrate connections. Copper pillar chip-to-substrate connections, including solder-capped and all-copper pillars, are potential replacements for solder balls with underfill in flip-chip applications. The thermal stresses...
This work presents the influence of post-annealing on mechanical and electrical properties of boron-doped hydrogenated nanocrystalline silicon (nc-Si:H) thin films deposited on Corning 7059 glass and Si substrate by plasma enhanced chemical vapor deposition (PECVD) technique. The basic mechanical properties of the films are measured by means of nanoindentation system. Using a four point resistivity...
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