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Power Electronic Module (PEM) design requires simultaneous analysis of thermal, electrical, and mechanical parameters to design an optimal layout. The current design process being used by package designers involves a sequential procedure instead of a simultaneous process. Each design step involves the analysis of the thermal, electrical or mechanical aspects of the design. As a result, the designer...
Multi-chip power module design requires simultaneous analysis of thermal, electrical, and mechanical parameters to design an optimal layout. The current design process being used by package designers involves a sequential procedure that is time-consuming and requires multiple design runs. The existing Power-CAD methodology that automates the module design process and optimizes the layout has been...
Automatic electro-thermal analysis is included into mentor graphics PCB design system. The method of simultaneous iteration is used for board-level electro-thermal simulation. New software tool named TransPower is introduced to couple the electrical (Analog Designer) and thermal (BETAsoft) simulators. The design procedure is fully automated, human errors are eliminated, simulation time is significantly...
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