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Three-dimensional (3D) integrated circuits (IC) are emerging as a viable solution to enhance the performance of Multi-processor System-On-Chip (MPSoC). The use of highspeed hardware and the increased density of 3D architectures present novel challenges concerning thermal dissipation and power management. Most approaches at power and thermal modeling use either static analytical models or slow low-level...
Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation costs during the IC design process. We analyze the performance and accuracies of a variety of time-domain dynamic thermal analysis techniques and use our findings to propose a new analysis technique that improves performance by...
Automatic electro-thermal analysis is included into mentor graphics PCB design system. The method of simultaneous iteration is used for board-level electro-thermal simulation. New software tool named TransPower is introduced to couple the electrical (Analog Designer) and thermal (BETAsoft) simulators. The design procedure is fully automated, human errors are eliminated, simulation time is significantly...
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