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Thermal analysis is an important technology for electronics equipment reliability analysis. In recent years, demands of thermal analysis for electromechanical products have been highly increased. In this paper, one electromechanical product, Stirling cooler in IR system, was modeled in thermal analysis software Flotherm used for electronic products. By studying the working principle and physical model...
Oxygen-enriched CFB combustion technology has the combined advantage of producing high CO2 concentration flue gas which is suitable for direct compression and sequestration and allowing excellent fuel flexibility. Due to the nature of oxygen-enriched combustion, the combustion characteristic of fuel in CFB boilers would be significantly different from those in the conventional CFB systems. To accurately...
Concentrated photovoltaic (CPV) systems dramatically reduce the size of the solar cell. However, they add thermal load to the solar cell which reduces its efficiency. This reduction is due to an increase in temperature, which is largely dependent on the thermal characteristics of the solar cell carrier. From 1 to 2000X solar concentration, we conducted thermal finite element simulations to determine...
We have developed and employed an automated multi-scale modeling approach to investigate thermal issues in analog integrated circuits (ICs) and to enable ldquothermally awarerdquo design thereof. Thermal analysis from full-chip scale down to the single transistor level was made possible with this approach utilizing the finite volume three-dimensional (3D) numerical technique. We have developed new...
A physical yet analytical phase change memory (PCM) model simultaneously accounting for thermal and electrical conductivities is presented. Due to the physics based nature of the model, the essential temperature from heating and cooling of PCM during operation is instantaneously updated. More importantly, the model can be applied to non-conventional circuit design technique. We show that for the first...
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