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Despite generation upon generation of scaling, computer chips have until now remained essentially 2-dimensional. Improvements in on-chip wire delay and in the maximum number of I/O per chip have not been able to keep up with transistor performance growth; it has become steadily harder to hide the discrepancy. 3D chip technologies come in a number of flavors, but are expected to enable the extension...
Increasing resistivity of copper with scaling and rising demands on current density requirements are driving the need to identify new wiring solutions for deep nanometer scale VLSI technologies. Metallic carbon nanotubes (CNTs) are promising candidates that can potentially address the challenges faced by copper and thereby extend the lifetime of electrical interconnects. This paper examines the state-of-the-art...
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