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Fan-Out (FO) chip on substrate is one of the fan-out solution for package integration. This solution brings the short interconnection between die to die for excellent electrical performance. Fan-Out chip on substrate device provides excellent electrical performance in multi-die connection,. The multiple re-distribution layer (RDL) processing is implemented in advance multi-dies FO chip on substrate...
Plastic ratcheting of aluminum interconnects has been a major reliability concern for microelectronic devices. Various failure mechanisms associated with passivation and dielectric cracking during temperature cycling test have been attributed to this fundamental material response. Thus, understanding of the elastoplastic behavior of aluminum metallization gone through the actual process thermal history...
Today, micro- and power electronic components are used within a rapidly increasing number of different automotive applications playing a key role within power generation and energy conversion systems. As a consequence, particularly the interconnecting materials of electronics systems are extremely challenged by harsh environment conditions like high operational temperatures, which are partially superposed...
The physics of failure for electrical components due to temperature loading is described. The main focus is on crack propagation in solder joints and damage accumulation models based on the Miner's rule. Two models are proposed that describe the initial accumulated plastic strain depending on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods...
The glass transition temperature of as-deposited parylene-C is first measured to be 50°C with a ramping-temperature-dependent modulus experiment. The creep behavior of parylene-C film in the primary and secondary creep region is then investigated below and above this glass transition temperature using a dynamic mechanical analysis (DMA) machine Q800 from TA instruments at 8 different temperatures:...
A finite element method involving Johnson-Cook material model and fracture criterion was used to simulate the cutting temperature distribution on tool rake face during high speed machining AISI 1045 hardened steel using commercial finite element software ABAQUS which can preferably handle such strongly non-linear problems and allow the definition of complex contact conditions. The simulation shows...
This paper investigates on refining lifetime models of power semiconductors. Especially the lifetime of heavy wire bonds is a weak spot and needs to be modeled in more detail. For a thorough understanding of the processes leading to a failed bond it is necessary to investigate more influencing factors than just the temperature excursion. Power cycling results for 125 ??m wire revealed a much higher...
Recently, it was discovered that by defect modification, the electromechanical responses of P(VDF-TrFE) based ferroelectric polymers can be modified significantly. Here, we present a room temperature phase diagram which illustrates the compositions of two classes of PVDF based polymers investigated in this paper. In the compositions at PVDF homopolymer, by including bulky monomers such as CTFE (chlorotrifluoroethylene),...
Decreasing the length of thermoelectric (TE) module legs results in a significant increase in power density, both for cooling applications and electricity generation. However, this reduction also results in a significant increase of mechanical stress in the legs materials. Thus, it is important to implement an effective method to characterize the mechanical properties, such as mechanical spectroscopy,...
The characteristic sharp reduction in electric strength exhibited by most polymeric materials at a critical temperature, Tc, is well documented.1, 2 There is substantial agreement that the low temperature breakdown mechanism is likely to be electronic in nature. A number of theories have been proposed although they all have the common feature that an indefinitely large electron multiplication determines...
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