The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This work demonstrates, for the first time, the possibility of optimizing both electrical and mechanical properties of SiGe MEMS structural layers at low temperatures (< 250??C). Using selective laser annealing (LA), it is possible to reduce the strain gradient of SiGe films deposited at 210??C to -1.6??10-7 ??m-1 and the electrical resistivity can be as low as 2.83 m????cm.
Indigenous Montmorillonite clay available from Kutchh region in western part of India was modified by Hexadecyl trimethyl ammonium bromide, a quaternary ammonium compound to make it organophilic. It was blended with high density polyethylene (HDPE) in a Brabender Plasticoder. The condition for blending was optimized and sheets were prepared for evaluating mechanical, electrical and thermal properties...
This work presents the influence of post-annealing on mechanical and electrical properties of boron-doped hydrogenated nanocrystalline silicon (nc-Si:H) thin films deposited on Corning 7059 glass and Si substrate by plasma enhanced chemical vapor deposition (PECVD) technique. The basic mechanical properties of the films are measured by means of nanoindentation system. Using a four point resistivity...
The tendency of high efficiency and high power density of power inverters needs three-dimensional (3-D) packaging techniques for power module packaging. In a 3-D power device packaging, it is necessary to bond electrodes to a substrate or other chips by solders. However, the "upper" electrodes of most power devices are metalized with Al and are very difficult to be directly bonded to a substrate...
The radiation effects on electrical and mechanical properties of LDPE/EVA blends with various vinyl acetate contents were investigated. Radiation degradation of LDPE/EVA blends was studied using TGA, gelation, volume resistivity, dissipation factor, elongation at break, and elastic modulus. As vinyl acetate contents of LDPE/EVA blends increased, the electrical insulation characteristics were deteriorated...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.