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In this study, the influence of adding Sn-0.7Cu, Sn-1.2Cu, Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu coating into Sn-58Bi/Cu interface was investigated during thermal aging by scanning electron microscopy with Energy Dispersive X-ray. And the coatings of the Sn-based solder on the Cu were made by using hot-dip method. The result showed the Sn-based coating on the Cu was effective at suppressing the IMCs'...
In these study, the effect of Bi content on shear strength of Sn-xBi (x=0, 2.5, 5, 15) solder balls were investigated. The Bi addition could improve the shear strength of solder balls, added 2.5wt.% Bi into pure Sn solder alloys had a greater increase in shear strength. The fracture mode always remained the same and the shear strength had no obvious changes with increasing the aging time. The Sn-2...
As the electronic packaging density continues to increase, flip chip or stacked packaging via bump bonding is gradually replacing traditional wire bonding and will become the mainstream packaging form in the future. For copper bumps, this new type of electronic interconnection has not yet been fixed by industry standards. Therefore, this paper has made a preliminary study on the reliability of this...
α-Fe2O3 nanomaterials with different morphology parameters were prepared by varying growth temperature in the thermal oxidation process. After current aging treatment, emission current density increased from 0.05 mA/cm2 to 5.70 mA/cm2 under applied electrical field of 7.8 MV/m.α-Fe2O3 nanoflakes prepared under 350 °C exhibits low threshold field of 5.1 MV/m. Current aging treatment was carried out...
The high temperature storage test (HTST) was conducted on the SnAgCu/Ni-W-P and Ni-Fe solder joints. While the conventional Ni-P solder joints were used as comparison to study the diffusion barrier effect of Ni-W-P and Ni-Fe under bump metallization (UBM). Both cross section and top view for the microstructural evolution of solder joints during 150°C aging were observed by the scanning electron microscope...
Nowadays, micro joint has been a widely used technology for the vertical integration of 3D IC. Even so, however, a common phenomenon after high temperature storage test or reflowing is that considerable voids are left in micro joints. Considering the strong relationship between reliability and the microstructures of micro joints, it is of necessity and interest to verify the factors which affect morphologies...
The effect of the variation of processing parameters such as thermal history, or the composition of Sn-Ag-Cu solder joints, on microstructure and reliability performance depends strongly on joint geometry, in particular length scale. The advent of 2.5/3D packaging technologies in microelectronics has further decreased joint length scales and changed interconnect aspect ratios to reduce I/O pitch....
The elevated working temperature of high temperature electronics can inevitably cause potential excessive growth of interfacial intermetallic compounds (IMCs), which can significantly deteriorate the mechanical integrity of electronic devices. Therefore, a robust diffusion barrier that can operate reliably under elevated temperature is highly demanded to retard the interfacial reaction between solder...
The high temperature storage test (HTST) was conducted on the SnAgCu/Fe-Ni solder joints. The microstructural evolution during aging at 125°C was observed by both Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM). During the reflow process, FeSn2 layer and rod-like (Cu,Ni)6Sn5 grains were formed. During the aging at 125°C, dispersed (Cu,Ni)6Sn5 with two distinct morphologies...
The microstructure and interfacial IMC layer of Cu/SACPG/Cu and Cu/SAC0307/Cu solder joints were comparatively investigated after thermal aging at 150°C for 0h, 24h, 168h and 500h, respectively. Results show that the morphology of IMC at the interface of Cu/SAC0307/Cu solder joint was consistent with that at the interface of Cu/SACPG/Cu joint, which indicates that the addition of P and Ge had little...
This study developed a low temperature soild-state direct bonding process for dissimilar metals. Experimental results show that Cu/Zn can be bonded successfully at 200°C under the loading of 10MPa for 30 minutes. The joints thus formed exhibited a shear strength up to 20MPa. If the thermal compression was performed at 300°C, the shear strength of bonded Cu/Zn and Cu/Ni/Zn joints exceeded 50MPa, especially...
Conventional packaging materials for light-emitting diodes (LED) are susceptible to UV radiation and high temperature. Therefore, for developing UV LED packages, new materials with better UV and high temperature resistance are required. There are two candidates, namely, epoxy molding compound (EMC) and silicone molding compound (SMC), being considered by the industry. This paper focuses on the change...
In this study, sandwich structures of Ni/Sn/Ni was prepared by a general electroplating process. A high temperature storage test was conducted by isothermal aging at 180°C. Microstructure characterizations revealed that after 24 hours of heat treatment, the Sn solder consumed completely. Cross-sectional microstructure showed large voids was left among the IMC. The ratio of Voids is much beyond −11...
In this paper, we describe a novel mechanism of Ag microflakes sintering which is not yet reported. It involves the generation of Ag amorphous layer, the nucleation and recrystallization of Ag nano particles and dynamic replication of the above-mentioned steps. Transmission electron microscopy (TEM) is utilized to characterize the Ag microflakes sinter joining, which reveals sintering is under the...
This paper presents the time varying characteristics of partial discharge (PD) activity in a cylindrical cavity within polymeric insulation. The samples are produced using a multiple layer technique with polyethylene terephthalate (PET) selected as the solid dielectric. The results highlight the degradation process of the cavity surface through the exposure to a HV AC electric field and the impact...
The insulation of power supply cables is increasingly performed by non-polar polymers. These materials, mainly polyolefins, combine low density and low cost of production. Among them, cross-linked polyethylene (XLPE) is up to date the best choice for an effective high voltage insulation. The aim of this work is to investigate the possibility to find out a new materials for electrical insulations that...
The propagation characteristics of water trees at different temperatures were investigated, and the effect of chain orientation on water tree morphologies was revealed. Accelerated water tree aging experiment was performed respectively at 0°C, 20°C, 40°C and 60°C for XLPE specimens. The morphologies of water trees were observed by an optical microscope, and the sizes of water trees were counted. The...
Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
The effects of Cu orientation and stand-off-height on the microstructure and growth of IMCs in Cu/SnAgCu/Cu solder joints was investigated. Cu6Sn5 and Cu3Sn were the two key intermetallic compounds (IMCs) that formed at the interface. On (111) Cu substrate, prism-like Cu6Sn5 grains could be observed after reflowing at 250°C for 10s. On polycrystalline Cu substrate, only scallop-like Cu6Sn5 grains...
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