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A MoO3/Ag/MoO3 (MAM) transparent electrode was developed which aims for realizing transparent organic light-emitting diodes (TOLEDs) with different emission colors. The performance of the transparent electrode is significantly influenced by the thickness as well as the surface morphology of the silver film in MAM structure. The thermal evaporation process of the silver layer adopted varied deposition...
Plating permeation in the process of nickel and tin electroplating greatly reduced soldering reliability of products and drawn particularly attention from MLCC manufacturers. Based on the results of SEM and EDS analysis, it indicated that the silver end terminations spread from edges to middle in the surface of ceramic body in sintering process, and formed a lOOLim width transition areas near silver...
In this study, Ag/NiNiP-plated Cu leadframes from two different processes are compared in terms of NiNiP surface morphology, composition of NiP layer, grain structures of Ni and NiP plated layers, and impurities in the interface of Ni/NiP plated layers. Their impacts were assessed after solder plating and baking. Scanning electron microscopy (SEM) shows that the grain size of Leadframe A (from Process...
This paper discussed the surface resistance of carbon nanotube (CNT)/inorganic binder/silver composites film. The used CNT were multiwalled CNT with diameter of 20 nm-40 nm and 5-15 m in length. We used two inorganic binders: sodium metasilicate and tetraethyl orthosilicate (TEOS) and two silvers: nanosilver in powder and solutions. The CNT were separated and dispersed in inorganic binder with different...
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