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The chip scale packaged/ball grid array component boards were thermally cycled according to the IEC 68-2-14N standard (+125°C/-45°C, 15 min dwells, 5 min ramps). The as-solidified microstructures of Sn-rich solder interconnections were composed of relatively few, typically from two to five, large tin colonies distinguished by high-angle boundaries. However, during the thermal cycling tests the as-solidified...
The article consists of a Powerpoint presentation on electromigration characteristics eutectic SnPb and Pb-free solder alloys. The paper concludes that fundamental electromigration characteristics of eutectic SnPb and SnAgCu lines is obtained using in-situ SEM observation. Alloying effect on existence of incubation time. Incubation stage exists in eutectic SnPb due to the preceding Pb migration, while...
Cu interconnects are required for high-performance system-on-a-chip because of their high performance and reliability (Yokogawa et al., 2001) and (Yokogawa, 2004). However, electromigration lifetime decreases with the cross-sectional area of the line (Yokogawa and Tsuchiya, 2005). To improve reliability, Cu-alloys such as CuSn (Tonegawa et al., 2003) and (Lee et al., 1995) and CuAl (Matsubara et al...
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