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Based on the theories of Back-Propagation (BP) Artificial Neural Networks (ANN) and Genetic Algorithm (GA), combining with multiple statistical analysis method, fatigue life prediction and technological parameter optimization of QFN solder joints were studied in this paper. Firstly, correlation coefficient matrix of the swatch was gained by factor analysis; taking length and width of the pad, stand-off...
PbSnAg solder was widely used in die attachment for high power chip packaging, and the thermal-mechanical reliability of PbSnAg solder layer is a key factor to evaluate the quality of high power devices packaging. Viscoplastic finite-element simulation methodologies were utilized to predict Pb92.5Sn5Ag2.5 solder joint reliability for die attachment under accelerated temperature cycling conditions...
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution...
The mechanical bending test results, as well as the modeling and calculation data were presented in this study to characterize the solder joint reliability. Bending test was completed simply by loading a series of displacements on the FR-4 printed circuit board (PCB) with devices and solder joints in single direction. A special bending tester that can control displacement exactly by a cam system was...
Currently, various mainly tin-based lead free solders are in use or under evaluation. Many solder fatigue models have been developed to predict the fatigue life of solder joints under low-cycle fatigue conditions, however, because of the diversity of solders, more work is needed in this respect. The theoretical fatigue life prediction of solder joints, based upon non-linear finite element (FE-) calculation...
This paper focus on the study of solder constitutive model effect on solder joint fatigue life prediction. Two loading conditions are considered, namely thermal cycling and cyclic bending. In this study, four different solder constitutive models including elastic-plastic (EP), elastic-creep (Creep), elastic-plastic-creep (EPC) and viscoplastic Anand's (Anand) models are implemented in FE modeling...
Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder...
With the relentless trend in ever-increasing number of I/Os on packages and the decreasing pitch of interconnects on packages, the task of modeling the fatigue life of the interconnects is becoming evermore challenging. This paper presents a RVE hybrid slim sector model which could be employed to meet the challenge. In this model, almost all the interconnects between chip and substrate are replaced...
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