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The interfacial reactions and formation of intermetallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging were studied by using a differential scanning calorimeter. Results show that a thin circular Cu6Sn5 layer forms first on the surface of Cu substrate due to the diffusion of Sn atoms dissolved in the soldering flux, subsequently the planar-like Cu6Sn5 layer forms...
Microstructure and properties of the Al-7Si-0.5Mg-xLi (x=1, 2, 3) alloys were investigated. The microstructure was observed by optical microscopy, DSC was determined by a differential scanning calorimetry, and the hardness was determined by Vicker's tester. The results show that the primary Si phases are present in the alloys. The amount and size of primary Si phase increase with the increment of...
Suitable thermal treatments can be used to modify the microstructure of polymer electrets, which in turn may lead to better electret properties. In this paper, non-porous and porous PTFE films are subjected to a thermal treatment consisting of heating at 320°C for 2 min followed by quenching in liquid nitrogen. The influence of such a treatment on the charge stability of the film electrets is studied...
Epoxy polymers reinforced with a premixed epoxy/nano-silica masterbatch or dry non-surface-treated nano-silica and ground micro-silica flour were compared. Cured plates of epoxy containing both nano-particles (up to 15 %wt) and micro-particles (up to 51 %wt) of silica were produced and tested. The glass transition temperature, Tg, of the epoxy was measured using differential scanning calorimetry (DSC),...
SAC-Ti alloys exhibited significantly improved drop test performance over not only SAC alloys, but also 63Sn37Pb for ENIG/OSP, NiAu/OSP, and OSP/OSP surface finish systems. The superior performance is attributed to (1) the increased grain size and dendrite size, therefore reduced hardness of solder, (2) inclusion of Ti in the IMC layer, and (3) reduced IMC layer thickness. DSC data indicate that the...
RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221degC and 217degC, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of...
Due to the increase in the use of electronics devices within the industry, the usage of solder connections has increased. These is a concern that lead within the electronic products is considered toxic because lead has potential for leaching from landfills onto water sources and becoming a hazard to human health and surrounding environment. For this reason, replacing Sn-37Pb to free solder with low...
In-based solders were chosen for the low temperature bonding at lower than 180degC. Three kinds of bonding types on Au/Cu/Ti/SiO2/Si dies, which were Sn/In and Au/In for Type 1, Au/In and Au/Sn for Type 2, and InSn alloy and InSn alloy for Type 3, were studied expecting that the whole In- solder layer is converted to the mixed intermetallic compound (IMC) phases of In-Cu and In-Au IMCs after bonding...
Clathrate Ba8Al16Si30 was produced by arc melting and hot-pressed and effects on the microstructure and thermoelectric properties were investigated. The ingot was crushed into powders in a glove box. The powders were hot-pressed at 1,073, 1,123 and 1,173K using a stress of 60 MPa for 2 hours. The phase transformation behavior of hot-pressed Ba8Al16Si30 was examined by thermo-gravimetric analysis (TGA),...
Summary form only given. A number of metallic glasses that exhibit a wide supercooled liquid region before crystallization and a high glass-forming ability have been discovered. These metallic glasses exhibit useful properties such as high strength and high stiffness and can be fabricated from the melt in a bulk form with a thickness of ~ 10 mm. The high glass-forming ability facilitates the formation...
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