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Chitosan microspheres were prepared by ion induction and chemical cross-linking using water as the medium. Natural rubber/chitosan microsphere blends were then prepared by blending the chitosan microsphere suspension with natural rubber latex. An infrared spectrometer, particle size analyser, scanning electron microscope, surface contact angle analyser, thermogravimetric analyser, and differential...
The amphoteric dispersant, synthesized by methyl acrylic acid (MAA), sodium allyl sulfonate(SAS) and methacryl oxyethyl trim ethyl Ammonium Chloride (DMC), is used for the preparation of coal water slurry. The samples were characterized and analyzed by IR. spectrum, GPC and TGA-DSC. The ability of being slurry, rheological behavior and static stability of coal water slurry are investigated. It is...
The paper prepared and experimentally studied the thermal properties of paraffin binary mixtures and fatty acid binary mixtures. These binary mixtures have suitable phase change temperature and big phase change latent heat for wall. The phase change temperatures and latent heats of the phase change materials were tested by differential scanning calorimeter(DSC) after multiple heat cycle. The testing...
Summary form only given. This work investigates the reflow behavior of lead-free Sn-3.8Ag-0.7Cu solder on Cu substrate in the presence of Mo nanoparticles up to 0.1 wt%. Solders were reflowed in a reflow oven up to six times. The melting behavior of the composite solder was investigated by differential scanning calorimeter. The spreading rate and wetting angle were evaluated to measure the solderability...
Wafer level packaging is the technique that encapsulates integrated circuit on the wafer directly and different from the traditional IC package. Comparing with the traditional IC package, wafer level chip scale packaging has several advantages such as: smaller package size (reduce area and thickness), lighter weight, more fabricate simply, better electric performance and cost down. Therefore, the...
The interfacial reaction between pure Sn and different metallizations of Cu, Ag, Ni and Co, as well as the melting/solidification characteristics of each reaction system were investigated using a differential scanning calorimeter (DSC). Results show that there exists the early interfacial eutectic reaction in Sn/Cu and Sn/Ag systems, which leads to the occurrence of the Sn melting at the interface...
The aim of this work is to find a novel phase change material (PCM) used in the building envelope. The phase change temperatures phase change latent heats and thermal stability of different proportion glycerin and 1, 6-hexandiol mixtures were experimentally studied. The phase change temperature and phase change latent heat were determined by differential scanning calorimeter (DCS). Thermal cycling...
A generalized hybrid modeling is proposed to estimate the chemical shrinkage and modulus evolutions at arbitrary temperatures. Using the existing curing kinetics modeling, a theoretical formulation is developed to provide a mathematical relationship between the evolution properties at arbitrary temperatures and those obtained at a reference temperature. The evolution properties at the reference temperature...
Thermally conducting and effectively electrically insulating nanocomposites for thermal interface applications were developed by dispersing graphite nanoplatelets (GNP) into a silicone matrix by dual asymmetric centrifuge mixing. Thermal conductivity, electrical conductivity, compression and hardness properties of the resulting composites were measured. The effects of GNP particle size and wt.% of...
With fast development of electronic packaging, the conductive adhesives were widely used in surface mount and chip interconnection. As an alternative to solder, it has many advantages, such as low processing temperature, less environment contamination and fine pitch capability. However, conductive adhesive joining technology also simultaneously faces a lot of challenges. The major problem of current...
An enhanced open ended waveguide cavity oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor...
Packaging technique for MEMS devices such as selection of appropriate materials, proper process steps and approaches are crucial to meet the end product requirement in terms of overall package functionality and performances. Packaging MEMS devices requires low modulus die attach material due to their delicate intrinsic properties against interfacial mismatch as a result of thermo-mechanical stresses...
In this paper, a new aspect of thermosonic (TS) bonding with anisotropic conductive film (ACF) is presented to take into account the fast curing of ACF. For quick bonding process with ACF, the lateral ultrasonic vibration is applied in parallel to thermocompression (TC) process. The feasibility of TS bonding is demonstrated by experiments for chip-on-glass (COG) bonding. To understand the curing characteristics...
High pour point properties of crude oil are generally due to the high wax content, so the study of the laws and the characteristics of wax deposition are significant for taking steps to save energy and transport safely. For the wax deposition of high pour point crude oil on pipeline wall, basing on a small-size wax deposition loop laboratory experimental apparatus to simulate the wax deposition of...
In this study, three kinds of nonconductive film (NCF) adhesives named as NCF I-NCF II and NCF III, were applied to COF package with compliant-bump. Firstly, to investigate bonding temperature effects, the curing rate of the NCFs and strength of interconnection under different bonding temperatures (150??C ~ 230??C) were evaluated using differential scanning calorimeter (DSC) test and a 90 degree peeling...
This paper introduces a class of single crystal silicon micro-scale differential scanning calorimeters for rapid detection and thermal characterization of energetic materials. The suspended membrane micro hotplates have fast time response and high sensitivity, which enables thermal measurements of melting endotherms and deflagration exotherms in energetic materials such as RDX and TNT. The potential...
Various apparatus were used to analyse the structures and the surface states of the nanodiamond particles synthesised by detonation, including a high-resolution transmission electron microscope (HRTEM), an energy diffraction spectrometer (EDS), an X-ray diffractometer (XRD), a Raman spectrometer (Raman), a Fourier transform infrared spectrometer (FTIR) and a differential scanning calorimeter (DSC)...
In this paper, a novel isotropic conductive adhesive containing different fillers, which shows better properties at high temperature compared with traditional ones, was developed and the properties of various fillers were investigated. Silver flakes as the main filler and secondary materials such as silver nanoparticles, carbon nanotubes (CNT) with different volume ratios are combined to form bi-modal...
An intercalation nonlinear-optical (NLO) polyimide was synthesized by the ring-opening polyaddition of 4,4'-(Hexafluoroisopropylidene) diphthalic Anhydride (6FDA) and [(6-nitrobenzothiazol-2- yl)diazenyl]phenyl-1,3-diamine. Then, sol-gel technique was adopted, utilizing 3- aminopropyltriethoxysi- lane (APTES) and tetraethoxysilane (TEOS). The polyimide/silica hybrid material was obtained. The polyimide...
A series of the polyimide-silica NLO nanohybrid materials were synthesized from 3,3', 4,4'- Bisphenyltetracarboxylic (BPDA), 2,2-Bis(3-amino-4-hydroxyphen-yl) hexafluoropropane (6FHP), nonlinear optical (NLO) molecule 4-(N-2-Hydroxyethyl-N-methylamino)-4'-[(6-nitroben-zothiazol-2-yl)-diazenyl] azobenzene (HNBDA), coupling agent APTES and hydrolysate of TEOS via sol-gel process. The TEOS contents in...
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