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With increasingly high currents flowing though CPU sockets in thermally-challenged systems, socket temperatures have recently been projected to approach, and even exceed, their thermal reliability limits. The prediction of socket and board temperatures through modeling and simulation is well-established and refined. The modeling methodology based on CFD simulation accounts for Joule heating power...
Calculation and display of a thermal bottleneck scalar field as an integrated part of a CFD simulation enables a practitioner to interact with and understand the physical mechanisms by which heat is removed from an electronics system. By applying the characteristics of this thermal bottleneck scalar to heat sink design aspects, one can identify near optimal solutions with a minimal number of simulations...
The two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently,...
As for other electronic or optoelectronic devices, the package of a high-power laser bar has to provide the following basic features: 1) Mechanical stability for mounting and handling; 2) Electrical contacting of the n-side and the p-side of the device; and 3) Cooling to remove the waste heat generated by the diode laser. Given the large power turnover and comparably small size of a diode laser bar,...
This paper presents an innovative design for a high heat flux cooling system. The system's compact package includes a forced thermal spreader with a small pump, a manifold minichannel air heat sink, and an air mover. The forced thermal spreader can greatly reduce spreading thermal resistance, and bring uniform temperature distribution on a top surface - which will enhance the heat dissipation performance...
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