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Thermosonic copper ball bonding is an interconnection technology that serves as a viable and cost-saving alternative to gold ball bonding. However, the reliability of copper bonds remains to be ascertained. Intermetallic compounds (IMCs) and possible voids and cracks may grow and propagate at the interface of bonds during their service. The proper IMCs formation is beneficial to bonding strength but...
In this paper, thermal cycling reliability along with ANSYS analysis of the residual stress generated in heavy-gauge Al bond wires at different bonding temperatures is reported. 99.999% pure Al wires of 375 mum in diameter, were ultrasonically bonded to silicon dies coated with a 5mum thick Al metallisation at 25degC (room temperature), 100degC and 200degC, respectively (with the same bonding parameters)...
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