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GaAs-based Blocked-Impurity-Band (BIB) detector, as a potential high-sensitive, low noise Terahertz (THz) detector, has been developed for the broad application in the area of THz security check and astronomy mission. In this work, GaAs:Si and GaAs:Te BIB detectors were fabricated. Their responsivity properties were measured at T=3.5K, under different biases and the same black body temperature of...
In this paper, a new LDMOS on silicon-on-insulator (SOI) with homo-type fixed interface charges in the bottom of field oxide layer is proposed. The surface electric field can be improved by adding the fixed interface charges and optimizing the doping profile, which can effectively modulate electric field to obtain the optimization trade-off between the breakdown voltage and on-resistance. The numerical...
Increasing the base doping concentration, utilizing gold as the recombination center, employing high quality oxide layer and applying the hardening design for physical structure could effectively reduce the change rate of current gain after irradiation. This conclusion is found out by analyzing the variation of the current gain of bipolar junction transistors with components in different craft.
In this paper, we simulate and investigate a novel Tunnel Field-Effect Transistor (TFET) using the charge plasma concept on the source side. Herein, an inverted p-type source is created to form a p+-n tunneling diode structure on a uniformly n-type doped thin silicon film, hence named, Inverted-TFET (I-TFET). Using calibrated simulations, we verify that the Ion is boosted (□ 20 times) in the proposed...
There is a demand to further improve upon performance parameter of particle detectors for high luminosity applications. Higher breakdown voltage, larger signal, lower leakage current and low noise is the primary requirement for future detectors. We want systematic study and investigate one of the important parameters namely the breakdown voltage and want to achieve optimum result for future detectors...
A novel SOI trench LDMOS with vertical double-RESURF is studied in this paper. A p-type silicon pillar is inserted beside the oxide trench as a vertical double RESURF layer, which can effectively modulate the electronic field and enhance the doping concentration in the drift region. The drain n+ region extends to the surface of buried oxide layer, shortening the motion-path in the high-resistance...
In this paper, low cost 1200V UHV LDMOS device has been proposed. As BVD and Ron are contradictory, so to make low Ron, high breakdown voltage is the challenge of this paper. The key feature of this device is the linear P-top which is used to obtain best charge balance, and increase the diffusion current to move faster in the drift region which reduces the electric field and substantially helps to...
In this work, the electrical isolation of nanowires fabricated on bulk wafers is investigated. It is shown that electrical isolation can be realized with a Ground Plane isolation implant at the beginning of the process flow. For transistors using extensions, it is seen that a relatively high dose of Ground Plane doping is needed in order to avoid punchthrough through a parasitic channel less controlled...
Recent research progresses on dopant diffusion and segregation, Si-Ge interdiffusion and defect engineering in SiGe material systems are reviewed, which are relevant to SiGe-based semiconductor devices including SiGe PNP hetero-junction bipolar transistors, metal-oxide-semiconductor field-effect transistors, and Ge-on-Si lasers. Experiment data and continuum modeling are discussed.
We present an experimental investigation of the nonlinear response of acceptor impurities in semiconductors to coherent excitation with intense THz fields. In Zn-doped GaAs, we observed a well-defined saturation of the transition from the impurity ground state to the excited states and valence band. In B-doped Si, however, there is a clear indication of field-induced distortion of the impurity energy...
We present the Ge Zener-Emitter injection mechanism for synthesis of an indirect semiconductor optical amplifier (ISOA), featuring gain characteristics and electro-absorption modulation with extinction ratios > 14 dB by sufficient Moss-Burstein shift, for generic Ge-on-Si Photonics platform.
Three Ge-on-Si photodetector architectures with different contacting schemes are compared, with emphasis on their bandwidth. The study shows that bandwidth > 50 GHz and responsivity > 1 A/W at 1490 nm can be achieved using a commercial silicon photonics process.
Ge-on-Si has been demonstrated as a platform for Si foundry compatible plasmonics. We use laser thermal annealing to demonstrate activated doping levels >1020 cm−3 which allows most of the 3 to 20 μm mid-infrared sensing window to be covered with enhancements comparable to gold plasmonics.
Ion implantation is the most important silicon doping method in the process of semiconductor manufacturing. The common used analysis methodology such as FIB/SEM/TEM is restricted in analyzing the ion implantation related defects, while the chemical stain technology can provide very essential data in ion implantation process. The etching mechanism of silicon is very complicated with the mixture of...
In this paper, we report the simulation of high doping nanoscale heterojunction diode, particularly Si1−xGex/Si p-n diode, using Cogenda Visual TCAD. In order to gain knowledge on electrical properties of this diode, we exhaustively simulate the effect of Ge mole fraction in SiGe material on current, voltage and electric field characteristics. The simulation covers Ge mole fraction of 0.2 to 0.7 in...
Single-electron tunneling (SET) transistors have been studied for the past several decades because they are promising for low-power consumption and fundamental-level control of charge. The quantum dots (QDs) that are the main part of an SET transistor have been demonstrated in a variety of materials, but recently dopant-atoms in silicon have also been shown to work as QDs. However, a single conventional...
In this study, individually ballasted carbon nanotube (CNT) field emitter arrays (FEAs) using a doped silicon ballast resistor are designed and fabricated. Each CNT field emitter is in series with an n-type doped silicon resistor with 10μm in length, a doping concentration of 1014 cm−3 and a cross section area of 1 μm2 to limit FE current from a single emitter no more than 1.2 μΑ. A systematic study...
We investigate the effect of diameter and doping condition on thermal conductivity of vertical nanowires. Vertical silicon nanowire array/spin-on glass (SOG) composite films were fabricated using CMOS technology to extract thermal conductivity of vertical nanowire. The thermal conductivity is reduced by about 27% when diameter is decreased from 350 nm to 190 nm. In addition, boron doped and phosphorus...
Plasmonic nanostructures serve to enhance light-matter interaction at the nanoscale. Metallic nanoantennas in conjunction with group-IV-devices can be used to enhance the efficiency of scaled-down devices [1] or to develop concepts for integrated biosensing [2]. However, for applications at wavelengths in the near-IR and mid-IR range, metals suffer from high Drude damping as a result of the high charge...
We propose a novel vertical metal oxide semiconductor device with high permittivity (HK) trenches interleaved inside of the drift region (HKMOS). The novel structure guarantees uniform potential distribution for a wide voltage range at the blocking state owing the potential modulation effect of HK trenches, which also introduce accumulation effect to significantly reduces the specific on-resistance...
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