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Wire bonding is still the dominant interconnection technology for power semiconductors in power modules, e.g. for automotive or photovoltaic applications. In the past, many research activities have occurred in the field of reliability of power modules, where the life time of the complete module is affected by bond wire lift offs, heel cracks and other failures. Less effort was spent for investigating...
This paper reports on the extension of the wafer-scale microtensile technique to the piezoresistive characterization of thin-films, demonstrated for in-situ n-doped poly-Si layers. In addition to the reliable extraction of mechanical properties, this extended high-throughput method enables the acquisition of linear and, for the first time, nonlinear piezoresistive coefficients, namely the first and...
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