The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The emerging field of spintronics is undergoing exciting developments with the advances recently seen in spintronic devices, such as magnetic tunnel junctions (MTJs). While they make excellent memory devices, recently they have also been used to accomplish logic functions. The properties of MTJs are greatly different from those of electronic devices like CMOS semiconductors. This makes it challenging...
The contact resistance of CMOS device increases sharply withtechnology scaling, especially in SRAM cells with minimum size and/or sub-groundrule devices. Meanwhile, VT drifts caused by Negative-Bias Temperature Instability (NBTI) and Positive-Bias Temperature Instability (PBTI) degrade stability, margin, and performance of nanoscale SRAM with high-kappa metal-gate devices over the lifetime of usage...
The threshold voltage (VT) drift induced by negative bias temperature instability (NBTI) weakens PFETs, while positive bias temperature instability (PBTI) weakens NFETs fabricated with high-k metal-gate, respectively. These long-term VT drifts degrade SRAM cell stability, margin and performance, and may lead to functional failure over the life of usage. Additionally, most state-of-the-art SRAMs are...
With the feature size shrinking down to 65 nm and beyond, manufacturing process variation starts to significantly impact the device and interconnect electrical parameters, and therefore the performance of circuits. Back-end-of-line (BEOL) design for manufacturability concerns such as lithography variation and misalignment are more pronounced in the advanced technology node. Since SRAM cell always...
Three dimensional memory systems has been argued as a potential pathway in solving the ever growing difference between comparative speeds of CPU and memory systems. In this paper, we describe a three-tier, three-dimensional SRAM macro that has been designed and fabricated in a 0.18 um FD-SOI CMOS technology. 3D stacking is found to improve wire latency as compared to planar memory structure although...
This paper introduces a novel current sense amplifier (CSA) in sub-32nm fully depleted (FD) double-gate (DG) silicon-on-insulator (SOI) technology with planar independent self-aligned gates. A new architecture is proposed which takes advantage of the back gate in order to improve circuit properties. Compared to the reference circuit, the new architecture proves to be faster (21% sensing delay decrease),...
Continuous scaling, necessary for enhanced performance and cost reduction, has pushed existing CMOS materials much closer to their intrinsic reliability limits, forcing reliability engineers to get a better understanding of circuit failure. This requires that designers will have to be very careful with phenomena such as high current densities or voltage overshoots. In addition to the reliability issues,...
To increase memory bandwidth with minimum area overhead, the new concept of 3D-stacked memory structure consisting of a small sense amplifier shared with a few 3D memory cells has been presented. The 16 bit 3D-stacked TiO2 memory chip was fabricated and demonstrated. The estimated bandwidth per unit area of 3D-stacked memory in sub-65 nm CMOS technology indicates that the 3D-stacked memory has potential...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.