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IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 4 > 683 - 691
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 12 > 1957 - 1964
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 6 > 829 - 837
IEEE Transactions on Applied Superconductivity > 2017 > 27 > 4-2 > 1 - 5
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 5 > 762 - 767
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 5 > 726 - 733
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 4 > 544 - 551
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 1 > 69 - 79
IEEE Electron Device Letters > 2017 > 38 > 1 > 115 - 118
IEEE Transactions on Device and Materials Reliability > 2016 > 16 > 3 > 402 - 412
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 9 > 1308 - 1316
IEEE Transactions on Communications > 2016 > 64 > 6 > 2563 - 2577
IEEE Transactions on Device and Materials Reliability > 2015 > 15 > 4 > 500 - 510
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2015 > 5 > 11 > 1709 - 1719
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2015 > 5 > 8 > 1069 - 1074
IEEE Transactions on Device and Materials Reliability > 2015 > 15 > 2 > 214 - 219
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2015 > 23 > 1 > 118 - 130
IEEE Transactions on Applied Superconductivity > 2014 > 24 > 3 > 500405
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 8 > 1374 - 1379
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 5 > 751 - 761