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A via-first process for metallizing copper on glass substrates is presented using a thin, patternable polymer film, electroless copper deposition, and semiadditive processing. A procedure for partially precuring the polymer was developed in order to achieve a tented via structure after dry-film lamination and curing. The flexibility of the process is demonstrated by the use of plasma etching, CO2,...
This paper presents the design, fabrication, assembly, and characterization of a fully-integrated single-chip glass BGA package at 40/80 µm off-chip I/O pitch with multilayered wiring and through-package-vias (TPVs) at 160 µm pitch. The designed test vehicle emulates an application processor package for smart mobile applications, and enables for the first time measurements of DC signal transmission...
Metallizing ultra-thin glass interposer with through-vias with high adhesion and at low cost is one of the primary challenges in producing next-generation glass-based system packages. This paper describes and investigates a new approach towards creating a glass interposer structure with through-vias that is ready for solution-based metallization such as electroless deposition. Starting with glass...
This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturization is achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8...
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