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Sintered silver (Ag) is a porous silver attaching the semiconductor die to the microelectronic substrates. The market sizes for sintered Ag are explored, and the relevant patents are analyzed at macro and micro-levels. At the macro-level, patenting activity moves to Stage 2 of the technology life-cycle “s-curve”. In stage 2, patenting slows down before the next surge in patenting, likely to be spurred...
Miniature electronic systems are needed in a rapidly expanding array of applications ranging from wearable devices to robotics. This paper describes a production technique that utilizes environmentally friendly processes and relatively simple equipment to fabricate miniature system modules from leadless packaged components. Fine-feature nanoparticle silver conductors are used to interconnect leadless...
In today's electric vehicles (PHEV/HEV/EV), an extra cooling loop is needed to lower the power-electronics coolant temperature below about 65°C from the radiator coolant temperature of 105°C. One way to reduce the cost of future electric vehicles is to eliminate the extra cooling loop by developing reliable high-temperature power inverter modules that can be cooled directly from the radiator coolant...
Due to RoHS restrictions, researches on lead-free packaging have increased over the past decade. Low Temperature Joining Techniques (such as silver sintering or Ni-Au Transient Liquid Phase Bonding) are particularly studied because they are processed below 300°C and the attaches obtained are reliable at high temperature. Silver paste sintering technique for die backside attach is now a well-known...
New fields of high power inverter systems such like windmills, hybrid cars, hybrid trucks, and off road vehicles require new ways of power electronics integration and packaging. The requirements in size, weight, reliability, durability, ambient temperature, and environment are driving the operation temperatures of power electronics beyond the limits of today's industrial applications. In industrial...
Power electronics is a key technology for all vehicles with electric power train. The Low Temperature Joining Technique shows promising properties to meet the specific requirements for automotive power electronic systems such as compact design, high reliability and long life time. However, high complexity and high costs of production were in contrary to application of this technique for automotive...
Hybrid vehicle traction applications require compact power modules with high reliability. A major challenge is the lifetime under thermal cycles. While the requirements are moderate with respect to (active) power cycles, there are challenging requests for a high lifetime under (passive) temperature cycles. Base plates and solder interfaces limit the stability for temperature cycles in the classical...
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