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We report the development of a micropatterned nanocomposite composed of elastomer poly(dimethylsiloxane) (PDMS) and multiwalled carbon nanotubes, and its resistive response to large mechanical deformations. Microstructures of nanocomposite were embedded into unfilled PDMS to work as a strain sensor and devices were fabricated with simplicity through microcontact printing and screen-printing approaches...
The performance of integrated circuits has been growing exponentially, which has resulted in the development of a variety of VLSI products for communications, computers, and medical applications. The increase in the performance is mainly due to the decrease in the dimensions of the integrated circuit chip. To sustain this improvement, the industry has to overcome several technological challenges in...
We use infrared microscopy to image the temperature profile of graphene field-effect transistors operating at constant source to drain current bias. We find a peak in the temperature profile, i.e. a ??hot spot?? appears near the drain (anode) electrode of the graphene sheet at high current while operating in the hole-doped regime. We shift the hot spot position on the graphene sheet by tuning the...
Transport properties of single and multiwalled carbon nanotubes, with the tube axes aligned along the bias current direction, have been studied as a function of the temperature and applied current. The experimental data are consistent with a model of charge transport governed by tunnel between potential barriers created at the connection between the nanotubes or bundles surfaces and modulated by thermal...
Strain gauges based on multi-walled carbon nanotubes (MWCNTs) realize a higher sensitivity and a larger operation range than usual metallic strain gauges. Different technologies for CNT-layers have been realized. With the aim to find a suitable technology that allows the application of CNT strain gauges without use of adhesives. For this purpose two detergents (SDS: Sodium Dodecyl Sulfate and DOC:...
The paper presents recent advances in carbon nanotube interconnect modeling, with focus on their application to nanoscale chip packaging. An enhanced electrical model of carbon nanotube bundles is used, able to take into account the effects of different nanotube sizes covered by this application. The use of carbon nanotubes as chip to package interconnects at nanoscale dimensions is analyzed and the...
In this paper the level of influence of the most important geometrical and physical parameters on the 50% propagation delay of a realistic interconnect structure based on a CNT bundle and taking into account both driver and load characteristics is analyzed. The performed study is based on the Design of Experiments approach, and leads to the definition of the relative weight of the different parameters...
The quality of CNT films is important for many related applications. In this paper relevant processing parameters such as the sonication time, the CNT weight fraction and annealing process are investigated to characterize their influences on electrical properties of the produced CNT films. The results show that sonication time plays an important role for the quality of CNT films. At lower sonication...
After forty years of advances in integrated circuit technology, the scaling of Silicon Metal Oxide Semiconductor Field Effect Transistor (MOSFET) has entered the nanometer dimension with the introduction of 90 nm high volume manufacturing in 2004. Presently at 45 nm going to 32 nm node in 2009, the latest technological advancement has led to low power, high-density and high-speed generation of microprocessors...
Carbon based static dissipative plastics have been widely used in electronic industries for electrostatic discharge protection and prevention. Carbon nanotubes plastic, a new material candidate, holds many superior properties which benefit the electronics industry. The electrical performance advantages of carbon nanotubes plastic, such as electrical uniformity, part-to-part consistency and inter-part...
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