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Three dimensional (3D) IC integration technologies have become essential as the market demands for product with low power consumption, multi functions, smaller size and faster response have been increasing. 3D stacking with conventional high melting temperature solders such as SnAg and Sn may induce high thermal stress to the package. In this paper, chip to chip 3D stacking using no flow underfill...
The use of anisotropic conductive adhesives (ACA) in flip chip interconnection technology has become very popular because of their numerous advantages. The ACA process can be used in high-density applications and with various substrates as the bonding temperature is lower than that in the soldering process. In this paper, six test lots were assembled using two anisotropic conductive adhesive films...
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