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Main objective of this study is to design and development of multi-die embedded micro wafer level packages (EMWLP) reliability test vehicles. Such as, the laterally placed die EMWLP and the vertically stacked thin die EMWLP. For reliability evaluation, EMWLPs have been subjected to both environmental and mechanical reliability tests as per JEDEC standards. These reliability tests include highly accelerated...
Wafer level reliability (WLR) issues of DRAM cell and peripheral transistors are discussed. Since the 70 nm technology node, recessed transistors have been accepted for assuring data retention time of DRAM cell transistors. Various recessed transistor structures suggest that the most important issue in reliability, in addition to optimizing data retention time, is the elimination of local regions...
The main objective of this study is to validate the thermomechanical properties of materials used in some electronic components. The improved performance of HgCdTe infrared focal plane arrays requires reliability of the assembly at low temperatures down to 77K. Unfortunately, the thermomechanical behavior of most materials of these components remains to be clarified, particularly in a cryogenic environment...
The demand for wafer level packages (WLP) has increased significantly due to its smaller package size and lower cost. However, board level reliability of WLP is still a major concern. This study investigates the board level temperature cycle reliability of three very different wafer level package configurations. Comprehensive studies are carried out through temperature cycle test, failure analysis,...
This paper will describe a new technique to increase the reliability of wafer-level packages (WLPs). The technique enables the placement of a protective coating around the solder balls using a maskless process and provides improved reliability performance as compared to unprotected devices. In addition, the unbonded devices allow for easier handling. This approach also minimizes form factor requirements...
For advanced wafer-level chip scale packages (WLCSP), board level solder joint reliability is a major concern, and typical stress-relieving methods such as capillary underfills and molding compounds are costly. One method of low cost reliability improvement for WLCSPs is the use of a wafer level SolderBracetrade coating, which delivers improved reliability with minimal material and capital cost. In...
Screening latent defects in a wafer test process is very important task in both reducing memory manufacturing cost and enhancing the reliability of emerging package products such as SIP, MCP, and WSP. In terms of the package assembly cost, these package products are required to adopt the KGD (known good die) quality level. However, the KGD requires a long burn-in time, added testing time, and high...
To increase miniaturization, CSWLP (chip size wafer level packaging) has been developed. However, the difficulty to get good solder joint reliability leads to manufacture only small CSWLP modules. Different underfill methods are evaluated here, by measurements and simulations: results prove that underfill is necessary, but a bad choice can also decrease the reliability. An original method called ldquore-enforcementrdquo...
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