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This paper characterized the CM noise generation and coupling mechanism to predict the CM noise in Flyback converter. The spectrum of noise sources are analyzed using bandwidth-effects-FFT and the CM noise coupling paths are identified to build up a new CM noise analysis method. With this CM noise analysis method, the total CM noise and the contributions of all the coupling paths in the converter...
In order to improve compatibility at chip and system level, the electromagnetic compatibility (EMC) of digital signal controllers (DSCs) is analyzed in this paper. The EMC issues of DSCs, related to emission and susceptibility for chip including multiple complex peripherals running at fairly high-clock frequencies, and EMC control approach are considered. The DSCs electromagnetic model is proposed...
In this contribution a methodology for the prediction of critical device pins at PCB level with respect to induced transient impulses is presented. The method proposed is based on the identification of the most dominant signal propagation paths using single shortest path algorithms. Thus, the noise distributed from a source to many device pins is determined simultaneously considering all coupling...
The EMI/EMC problems appear in mixed-signal ICs with the increasing frequency and decreasing process geometries. In this paper, the amplitude modulation (AM) is taken into account the LC-VCO based on the TSMC 0.25 um mixed-signal process, and a cascade amplifier circuit, which is not complex, is proposed to optimize the LC-VCO through analyzing the noise coupling transition function of the LC-VCO...
The purpose of this paper is to investigate the significance of different coupling mechanisms that occur in a high precision D/A converter. The standard Integrated Circuit Emission Model approach is applied to an existing D/A converter built in TSMC CMOS 0.25 mum technology. Aggressors, propagation media and victims are defined and modelled using classical CAD tools. Potential noise sources and victims...
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