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A circuit description of the electromagnetic behavior in microwave filters by means of the data provided by FEM analysis in the frequency band of interest is detailed. Loewner matrix approach is used to carry out a tangential interpolation of the simulation data, giving rise to a linear dynamical system description fitting the simulation results. The FEM solver is then used as a black box unlike other...
In this paper a miniature circuit breaker (MCB) is analyzed using a finite method analysis (FEA) software. Once the 3D model was implemented, a series of simulations were carried out in order to find out the forces that appear inside the electromechanical trip unit and what influences the plunger to trip faster. Also, the influence of the material nonlinearity is emphasized in order to understand...
The linear induction motor (LIM) applied in low-speed Maglev train produces not only the thrust force to drive the train, but also the normal force that affects the levitation system. Three finite element models are employed to investigate the influence of transverse edge effect, longitudinal end effect, transverse edge shape of secondary aluminum plate and its temperature, etc., on the force performance...
3D integration becomes promising to be able to continue the system integration trend due to short TSV interconnection used for stacked dies. This paper proposes an efficient transient thermal modeling method using non-conformal domain decomposition approach for 3D stacked ICs and systems. To alleviate the problem arising from the feature scale difference between stacked dies as well as package and...
Through-Silicon Vias (TSVs) have recently aroused much interest because it is a key enabling technology for three-dimensional (3-D) integrated circuit stacking and silicon interposer technology. In this study, a 3-D 1/8th symmetrical nonlinear finite element model of a stack die TSV package was developed using ANSYS finite element simulation code. The model was used to optimize the package for robust...
In an excitation system of a certain type synchronous motor, current sensor for detection and protection often works under abnormal conditions. It leads to inability to play the role of the normal current detection, or even false tripping down the serious accidents. This failure is mainly generated by electromagnetic interference. Finite element analysis software is used to build the main circuit...
The modeling and simulation of via's effect on the data transferring or high frequency signal path and device performance have been one of the major concerns in the designing and testing of multilayered electric interconnects in applications like highly integrated system-in-package (SIP) and high-speed circuitry design. The authors of this paper explore the 3D full-wave modeling of through Si vias...
This paper has two main axis: firstly, we address the experimental characterization of the frequency-dependent thermal impedance of microwave bipolar transistors from continuous wave (CW)-only measurements (both DC and AC). From the experimental perspective, we will review some of the already available methods and propose a new method based on a recent observation. It will be shown that under proper...
Microwave Tube Simulator Suite (MTSS) is a full-featured software package for microwave tube analysis and design. Recent developments to the MTSS in last year will be presented.
The paper presents the results of investigations on planar inductors realized on flexible substrates for RFID antennas. The electrical parameters as: inductance, quality factor, self resonance frequency will be on the focus field. These parameters depend on inductor layout and on properties of materials used for realization. The inductor windings can be screen printed or jet printed with silver ink...
A comparison between modelling and simulation methods in regard to model order reduction (MOR) in finite element (FE) simulation tools is presented. Two main software tools are taken into consideration: ANSYS Multiphysics 11 with its extension MOR for ANSYS 2.55 and COMSOL Multiphysics 3.5a with a model order reduction interface to MATLAB/Simulink. The results achived with both software packages are...
Based on ANSOFT software, the 2d and 3d finite element models of switch reluctance motor were established, the dynamic simulations on the switch reluctance motor finite element models were researched by different control strategies. The accuracy and precision of the finite element models were verified by comparing the finite element results with MATLAB simulation results. The results show that the...
3-D models have been developed to study the series resistance (Rs) at DC and the extrinsic parasitic elements (capacitance and inductance) at high frequencies for a Schottky diode chip. For the Rs study, a comparison with the experimental result has been carried out. High frequency properties and the corresponding S-parameters of the Schottky diode chip are simulated using a 3-D finite element electromagnetic...
This paper provides a review of most commonly used numerical methods for computational electromagnetics. It points main strengths and weakness of given methods.
Microwave Tube Simulator Suite (MTSS) is a full-featured software package for microwave tube analysis and design. It has been developed by University of Electronic Science and Technology of China (UESTC) and validated against some helix traveling wave tubes.
The new version HFCS-E has capability to model SWS with dielectric loss rods. Some helix SWSs are simulated and results show that dielectric loss will cause resonance frequency a small falling, but not obvious difference of other parameters of helical SWS.
3D integrated circuit technology is an emerging technology for the near future, and has received tremendous attention in the semiconductor community. With the 3D integrated circuit, the temperature and thermo-mechanical stress in the various parts of the IC are highly dependent on the surrounding materials and their materials properties, including their thermal conductivities, thermal expansivities,...
Computational approaches, opportunities and challenges in reduced order modelling based on mode superposition method of the coupled electrostatic-structural domains, including effective model generation and geometrical parameterization, as well as physical and system design of MEMS component are presented and discussed.
In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D transient temperature distribution in the circuit can be revealed and the fusing phenomenon of interconnection is captured during the ESD process using human body model...
The approaches to get a circuit equivalent of microelectromechanical systems' (MEMS) mechanical components are considered. The usage of the circuit design software optimization procedures to adjust macromodels' parameters obtained as a result of the source equivalent circuit reduction is suggested. An example is considered and the simulation results are given for the problem of finding eigenfrequencies...
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