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Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
In this study, we conversed Bisbromomethyl-biphenyl and thiourea to a new biphenyl dithiol (BPDT) and used it as a co-curing agent. Its structure was confirmed by means of F-TIR, 1H-NMR, and MS spectra. We co-cured the conventional diglycidyl ether of Bisphenol A (DGEBA) epoxy resin with BPDT and aliphatic tetra-thiol (Pentaerythritol tetrakis(3-mercaptopropionate)) to get a colorless encapsulant...
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