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In our experiment the mechanical strength of solder joints formed by Vapor Phase soldering was investigated. A testboard was designed, which allowed fifty pieces of 0603 size chip resistors to be placed. The soldering was carried out by infrared conventional reflow and by Vapor Phase reflow as well. After soldering the shear strength of joints formed by both of the soldering methods was measured,...
The absorption behavior of Ag3Sn particles on the surface of intermetallic compounds (IMCs) formed at Sn-3.5Ag-xCu/Cu (x=0, 0.7, 1.5 wt. %) interfaces was studied. The Sn-3.5Ag-xCu/Cu solder joints were prepared by reflow soldering at 260degC for different time. The X-ray diffraction results showed that the dominant IMCs formed at Sn-3.5Ag-xCu/Cu interfaces were Cu6Sn5. For Sn-3.5Ag/Cu and Sn-3.5Ag-0...
SnPb solder joints are an essential part for microelectronic packages manufacturing industrial for a long time. In recent year, environmental concerns and RoHS (Restriction of Use of Hazardous Substances) has demanded elimination of lead from electronics products by July 1, 2006. However, base on increasing pressures to achieve environmentally friendly electronic materials and processes, and indeed,...
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