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This study focuses on the corrosion of immersion silver (ImAg)-finished copper land patterns on printed circuit boards (PCBs) under H2S exposure. Eight test conditions were examined with varying levels of H2S, temperature, relative humidity, and exposure time. The results indicated both direct chemical-reaction corrosion and electrode-reaction corrosion, particularly galvanic corrosion. H2S gas was...
In power management semiconductor industry, the most comprehensively used metals in microelectronic packages include copper, aluminum, nickel, gold and silver. When different metals contact to each other, intermetallic compound (IMC) will form at the interface. Under different conditions, IMC may vary to show very complicated characteristic and composition, some Moderate IMC will increase interfacial...
Lead frame is the primary package metallurgical bond pad interface in microelectronic devices which provides external interconnection. The most predominant lead frame material is copper with tin plating. Over the years, galvanic corrosion and copper oxidation are two main reliability concerns for any microelectronics packages with copper lead frame, when operating under high humidity environment....
A high yielding copper damascene process requires defect-free copper surfaces after Cu polish. Critical defects derive from corrosion processes such as pitting corrosion, galvanic corrosion and excess etching. Changes in process conditions for Cu polish as well as the interaction with Ta polish step in a two-step (Cu/Ta) Ta polish can assist in defect reduction. Since these corrosion defects derive...
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