The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
It becomes a trend of replacing Au wire bonds with Cu wire bonds in the plastic IC packages due to the benefit of cost saving and electrical performance. Some plastic packages, such as FGBA package used for Flash Memory devices, utilize a new type of epoxy mold compound with higher reliability. Such mold compound is harder against chemical etching than other mold compounds and poses a greater challenge...
Humid atmospheres may pose a critical reliability hazard in microelectronic packages, as they are comprised of metals prone to moisture-induced galvanic corrosion. Galvanic corrosion is a global issue that is affecting variety of devices in semiconductor industry. In this paper, we simulated galvanic corrosion via unbiased HAST on flash memory encapsulated in plastic lead frame packages with tin-plated...
During CDM-ESD test, misalignment may occur between the discharge pin and the DUT terminal, especially when the package size shrinks down. We investigated the effect of top ball touch (non-misaligned) and side ball touch (misaligned) on the electrical characteristics of memory devices. The experimental data were analyzed using statistical hypothesis tests and supported by the physics theory of Gauss'...
The green initiative has driven semiconductor manufacturers to eliminate the use of environmentally unfriendly substances such as antimony oxide, flame retardant and halogenated compounds in their microelectronics packages. Nevertheless, there may be concern that the new chemistries in green package may alter the properties of semiconductor devices. We have evaluated the performance of power transistors...
Gold wire bonding to aluminum pad is a widely applied interconnection method in microelectronics industry for years. Copper wire bonding has gained popularity due to its economic advantage and superior electrical performance compared to gold wire bonding. It has been known that at elevated temperatures, interdiffusion between ball bond and aluminum pad leads to intermetallics growth and voids formation...
Lead frame is the primary package metallurgical bond pad interface in microelectronic devices which provides external interconnection. The most predominant lead frame material is copper with tin plating. Over the years, galvanic corrosion and copper oxidation are two main reliability concerns for any microelectronics packages with copper lead frame, when operating under high humidity environment....
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.