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Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify...
For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal...
In order to improve electronics packaging design, it is important to evaluate the cooling performance and reliability of the electronics packaging structure of a product. To that end, it is necessary to predict the temperature, deformation, and stress distributions of the package under field conditions. In the case of a packaging structure comprising a flip-chip ball grid array package, a heat spreader,...
Failure of organic packages is often accelerated by mechanical failure of an underfill designed to protect the solder joints. The crack growth rate of an underfill under thermal cycling is crucial for package reliability and lifetime prediction. Mechanically-induced fatigue crack growth results have been used in package reliability studies, but thermally-induced fatigue crack growth data for underfills...
For power devices, the reliability of thermal fatigue induced by power cycling has been prioritized as an important concern. Because, the power device like the converter system is the key in vehicle applications. So, high reliability is demanded by reduction in the size and high power capacity. Therefore shortening reliability evaluation is demanded using finite element method (FEM). Since power cycling...
For power electronics devices, the reliability of thermal fatigue induced by power cycling has been prioritized as an important concern. Since power cycling produces non-uniform temperature distribution in the device, coupled thermal- structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a package and a substrate causes thermal fatigue. Many...
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