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Fuji Electric developed a 1200V class RC-IGBT based on our latest thin wafer process. The performance of this RC-IGBT shows the same relationship between conduction loss and switching loss as our 6th generation conventional IGBT and FWD. In addition its trade-off can be optimized for hard switching by lifetime killer. Calculations of the hard switching inverter loss and chip junction temperature (Tj)...
Basic understanding of heating conduction in lead-free solder joints due to the Joule heating effect was carried out by using the infrared (IR) microscopy. In order to interpret the corresponding mechanism and provide a better understanding to Electromigration (EM) studies, a newly developed ID solder joint with same cross-sectional area in solder alloy and Cu electrodes was employed in our thermal...
A switch Application Specific Integrated Circuit (ASIC) chip implemented in six-substrate layers for low cost design which has more than 1000 pin-count. This paper deals with the electrical design of the high density package, including transmission characteristics of the key signal lines, crosstalk between signal lines, the coupling between neighboring power pins, DC IR drop and AC input impedance...
Hysteretic magneto-resistance of point contacts formed between non-magnetic tips and single ferromagnetic films exchange-pinned by antiferromagnetic films is investigated. The analysis of the measured current driven and field driven hysteresis agrees with the recently proposed model of the surface spin-valve, where the spin orientation at the interface can be different from that in the bulk of the...
A method for designing a transformer used in switching power supply is presented. The transformer designed by this method has advantages of the lowest power loss and higher power density than that designed by traditional method. Furthermore, the mathematical model of power loss which is closer to the reality is built in this study. Both the current density J and the flux density Bm in terms of the...
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