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Epoxy polymers reinforced with a premixed epoxy/nano-silica masterbatch or dry non-surface-treated nano-silica and ground micro-silica flour were compared. Cured plates of epoxy containing both nano-particles (up to 15 %wt) and micro-particles (up to 51 %wt) of silica were produced and tested. The glass transition temperature, Tg, of the epoxy was measured using differential scanning calorimetry (DSC),...
Environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221?C and 217?C, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of eutectic Sn-Pb solder2...
RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221degC and 217degC, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of...
In-based solders were chosen for the low temperature bonding at lower than 180degC. Three kinds of bonding types on Au/Cu/Ti/SiO2/Si dies, which were Sn/In and Au/In for Type 1, Au/In and Au/Sn for Type 2, and InSn alloy and InSn alloy for Type 3, were studied expecting that the whole In- solder layer is converted to the mixed intermetallic compound (IMC) phases of In-Cu and In-Au IMCs after bonding...
In this paper, we experimented the glowing and heating phenomenon at the contacts of copper wires, and studied the breeding process, the growing characteristics of copper oxide according to the diameter of copper wires and AC current. The surface structure, crystalline structure, compositions and calory variation of Cu2O that grew at the contacts of two copper wires were analyzed by using scanning...
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