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In recent years, Sn-Bi solders get much attention because low temperature bonding technique is possible to reduce warpage of package and stress at solder joining. However, few studies attempted to their reliability and knowledge of microstructure of the solder bump. In this study, we investigated the difference of inter-metallic compounds (IMCs) formation between Sn57wt%Bi solder (Sn-Bi eutectic solder)...
In this work, we have compared the performance of single rod crystal to a newly developed Distributed Face Cooling (DFC) structure which was made by surface activated bonding technology and allowed to combine transparent heatsink to a gain crystal at room temperature. The Sapphire and Nd3+:YAG crystal plates were combined in this fashion to produce nine crystal chip which was further used to obtain...
Development of surface acoustic wave (SAW) devices has been getting attention to achieve next fifth generation (5G) mobile communications. We had previously proposed a temperature compensated SAW substrate, LiTaO3 (LT: lithium tantalate)/ST-cut quartz (ST-quartz), with which directly combined piezoelectric single crystals using amorphous intermediate bonding (AIB) method. In this paper, we investigate...
In the present article, we report a breakthrough approach for the rapid growth of whole void-free and highly preferred orientation Cu6Sn5 IMC interconnects of 50 µm thick by the current driven bonding (CDB) interconnect method and the use of a single crystal seeding substrate. There was no grain boundaries within the Cu6Sn5 IMC interconnect and no voids at both interfaces, which is beneficial for...
We proposed a single crystal quartz direct bonding method utilizing amorphous SiO2 intermediated layers, which can improve heat resistance of the optical low pass filter (OLPF) by novel fabrication method. An amorphous SiO2 was deposited on the opposite sides of both infrared reflection and anti-reflection coated substrates to prepare the highly activated surfaces. The substrates were bonded at 200...
We newly developed a metal-bonded Langevin transducer using LiNbO3 in order to realize a practical high-power LiNbO3 Langevin transducer. It utilizes metal bonding with a lead-free solder as an assembly method for a Langevin transducer, instead of a bolt as used in a conventional bolt-clamped Langevin transducer. The newly developed metal-bonded LiNbO3 Langevin transducer achieved a high vibration...
The study of dipolar relaxation in hydrated Cerium Sulphate single crystals by TSDC (Thermally Stimulated Depolarization Current) reveals a non-Debye behaviour. The relaxation time does not follow an Arrhenius law. This fact is ascribed without ambiguities to dipolar interaction occurring during the relaxation process. This interaction arises from both the high density of structural dipoles existing...
Preparation of lithium niobate thin-film on silicon is demonstrated. The process employed is composed of mechanical thinning of the lithium niobate and bonding by using laser irradiation to the face-to-face interface of the two materials. The process is performed in the ambient air while keeping the wafers at room temperature.
To meet the high-temperature applications of the phase change memory, Ge1Cu2Te3 (GCT) has been proposed to be a suitable candidate due to its good amorphous stability. Here, we investigate the basic atomic bonding mechanism by first-principles calculations to understand this. The amorphous GCT has significant chemical disorder with large amounts of homopolar bonds. Cage-like clusters (composed of...
In this paper, a novel crystal component package based on silicon TSV interposer substrate is demonstrated by using 3D integration technologies. It is distinct from conventional crystal component using ceramic-based substrate. This crystal component with advanced silicon-based substrate shows great manufacturability to replace traditional fabrication approach. In addition, the SU-8 sealing bonding...
With the system to an integrated, modularization and long-life development, quartz crystal oscillator miniaturization, long life have become increasingly demanding. We wish to develop a new quartz crystal oscillators without the conductive epoxy to eliminate the change issues of crystal chip bonding material. First, it is required to develop small long life quartz crystal oscillator design, to solve...
The phase behaviors and kinetics of the polymorphic transitions of cyclohexanol, C6H11OH, were investigated by terahertz (THz) spectroscopy, over the temperature range from 150 to 330 K. A new phase was found, labelled phase I′, which is more stable than previously observed phase I but less stable than phase III′. The kinetics of the irreversible transitions from phase I to I′, I to III′, and III′...
Wafer-level quartz dry etching technology has been developed, which enables deep reactive ion etching (DRIE) for through-etch of ≥120-μm-thick crystal quartz wafers and an X-cut quartz DRIE. Our DRIE process employs direct wafer bonding of crystal quartz and silicon wafer by means of surface active bonding at room temperature and epoxy-based negative tone, i-line photoresist for the mask of the dry...
In this paper, one novel packaging approach for crystal resonator with the quartz crystal is demonstrated, developed and characterized. The proposed crystal resonator of the novel package adopts several 3-D core technologies, such as Cu TSVs, thin-film Cu/Sn eutectic bonding, and wafer thinning. A 1210 crystal resonator with quartz blank mount is successfully developed with Cu TSVs that enables the...
Thermal effects such as thermal lens and thermally induced birefringence are critical in solid-state lasers, degrading the beam quality and preventing higher-power operations. The composite lasers, which consist of laser-ion-doped and undoped materials, have been successful in supressing those thermal effects because the heat generated in the doped region can be effectively removed into the undoped...
We propose and demonstrate a novel one step method to integrate gold coated sensors with cartridges by dry covalent bonding. The cartridges are replica molded in an UV-curable off-stoichiometry thiol-ene (OSTE) polymer, featuring an excess of thiol functional groups that covalently bond to the surface of gold coated sensors upon contact. The method is demonstrated by the integration of a gold coated...
In this study we successfully bonded silicon wafer substrates with metal based thermocompression technology. This technology has the advantage of inherent possibility of hermetic sealing and electrical contact. We used three different kinds of metals: gold, copper and aluminum. We will show the hermeticity, bonding strength and reliability of the different processes and compare the results.
Conventional fabrication of MEMS devices based on the quartz consists of a high tech processing of the very crystal with electrodes and subsequent manual assembling to the package. The limitation of the manual assembling could be eliminated through integration of the processing and packaging in a single high-tech process by means of silicon/crystal quartz bonding. New integrated technology would be...
Misconceptions act as barriers to conceptual change, but uncovering and repairing them requires considerable effort. Thus, the research question is, "How effective is a simple pre-post topic assessment tool in uncovering misconceptions and assessing their repair and student conceptual change?" A multimodal pre-and-post topic assessment tool was created to identify misconceptions and assess...
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