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For comparing the stability and reliability of horizontal, vertical and flip LED chips, we carried on the high temperature and high current aging experiment towards to the three kinds of bare LED chips on our self-build online monitoring and accelerated life system. Most of samples shown stable performance during the entire experiment process, but there was only one flip LED chip whose illuminant,...
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb, designated as Indalloy276, was developed targeting for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature range of 223 to 232°C, reflowable at profile with peak temperature 245°C and 255C, with ambient temperature Yield stress 60MPa, UTS 77 MPa, and ductility 28%, and a higher stress than both...
A methodology for the design of canary devices intended for condition monitoring is described in detail for through-silicon vias (TSVs). Two different canaries a geometry change canary and a load-exposure change canary are proposed. To evaluate the proposed canary design qualitatively a comparative finite element study was conducted.
Yield and loss prediction plays an important role in the planning and operation of solar PV systems. The performance of a solar PV system depends on the location, system design, field of view, and the orientation of the solar panels in a given system. Some design and simulation tools are designed by professionals to connect to efficient planning and grid operations as well as stand-alone solar photovoltaic...
Moisture absorption of epoxy mold compounds (EMC) from IC packages is a serious concern especially for their reliability performance during stress tests. Numerous studies reported the popcorn cracking delamination due to moisture absorption of packaging materials during solder reflow [1]. Though no pop-corn delamination or other EMC to die pad delamination happened at time zero, current leakage may...
A piezoresistive silicon based stress sensor has been demonstrated successfully as an effective tool to monitor the stresses inside electronic packages during various production processes. More recently, the sensor has been evaluated as a sensor for Prognostics and Health Monitoring (PHM) systems. This paper presents a systematic approach that evaluates its performance from the perspective of failure...
Accidents involving trains have been attributed to degraded track and rolling stock. Detection of anomalies that indicate degraded condition is critical. In this paper we present results of an experiment using a sensor system mounted on one of the 110 boxcars on a train on a high-tonnage loop test track. The sensor was a microelectromechanical systems (MEMS) triaxial accelerometer module mounted on...
We demonstrate a photonic component high temperature testing system that features individual temperature control and in situ optical monitoring. By simultaneously testing the ASICs and optoelectronic devices, we reduce cost and increase the accuracy of high temperature testing,
The technology scaling towards the 10nm of the silicon manufacturing, is going to introduce variability challenges, mainly due to the growing susceptibility to thermal hot-spots and time-dependent variations (aging) in the silicon chip. The consequences are two-fold: a) unpredictable performance, b) unreliable computing resources. The goal of the HARPA project is to enable next-generation embedded...
An accurate assessment of the temperature distribution on the surface of the battery can be instrumental in prediction of the health and remaining lifetime in the battery/battery storage unit. Close monitoring of operational conditions and health can lead to significant saving in the overall cost and reliability of the targeted application. In this paper a new method for estimation of an effective...
We apply the physical principles of a familiar method, suns-Voc, to a new application: the real-time detection of series resistance changes in modules and systems operating outside. The real-time series resistance (RTSR) method that we describe avoids the need for collecting IV curves or constructing full series-resistance-free IV curves. RTSR is most readily deployable at the module level on micro-inverters...
In this paper, we present a bandwidth-efficient data reliability mechanism for Smart Grid Wide-Area Monitoring communication networks. Reliable transmission of data pack-ets, especially feedback control packets, is deemed a critical requirement. By sending multiple copies of data packets on node or edge disjoint paths, reliability can be achieved. However, this is inefficient in terms of bandwidth...
Service compositions are established to implement complex functionality based on elementary services in different application areas. The execution time of a service composition is crucial in many application domains. A service composition is said to be time-critical when its execution time is restricted. Because of uncertain response times, the execution time restriction of a time-critical service...
Extreme technology scaling in silicon devices drastically affects reliability, particularly because of runtime failures induced by transistor wearout. Current online testing mechanisms focus on testing all components in a microprocessor, including hardware that has not been exercised, and thus have high performance penalties. We propose a hybrid hardware/software online testing solution where components...
Quality of the performance and parameters of electronic devices under high-low temperature environments is one of the most important aspects for evaluating its reliability. To the problem that the junction temperature control of electronic devices is not accurate in large batch testing under high-low temperature environments, this paper establishes the junction temperature change equation with time...
As the market demands for high power and high efficiency power electronics, the industries has developed advanced IC technology and conceptual configuration. However, in order to guarantee the performance and reliability of the power electronics, the challenge of the packaging arises.
In today's electronic package development cycle, activities are managed by multiple participants in the supply chain which might have different quality and reliability impacts to the end product. As a result, the reliability risk is much higher for companies who do not have insight into and/or control over the products received. Design-for-Reliability (DFR) approaches will come into play to manage...
In this paper, state-of-the-art 1 mm RF power GaN-on-Si HEMTs using thick in-situ grown SiN cap layer are presented. Output power density POUT exceeding 10 W/mm is reproducibly achieved above 50 V drain voltage while still limited by thermal issues. In order to assess the device stability, the GaN-on-Si HEMTs have been tested at high channel temperature (> 300°C) and under high electric field (V...
This paper reviews recent experimental confirmations that the intrinsic radiation robustness of commercial CMOS technologies naturally improves with the down-scaling. When additionally using innovative design techniques, it becomes now possible to assure that performance and radiation-hardness are both met. An illustration is given with an original nano-power and radiation-hardened 8 Mb SRAM designed...
In this paper, we present a new technique to improve the reliability of H-tree SRAM memories. This technique deals with the SRAM power-bus monitoring by using built-in current sensor (BICS) circuits that detect abnormal current dissipation in the memory power-bus. This abnormal current is the result of a single-event upset (SEU) in the memory and it is generated during the inversion of the state of...
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