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Mission profiles for semiconductor applications are getting more and more challenging regarding electrical and thermo-mechanical robustness of metallization stacks. Effects, especially in thick metals, were investigated over the last years to find solutions for an improvement regarding both potential stressors. Some elements of a metallization were designed, investigated and simulated [1, 2, 3, 4...
According to prestress loss due to friction, several formulas that can be use to calculate pre-stressing tendon elongation are derived under the arrangement in straight line, circular curve or parabola layout in this paper, the solutions were proposed for different tensioning tendon and spatial pre-stressing tendon and we discussed the recurrent problems that existed in the calculation, especially...
Specification and target impose several limitations and difficulties in micro manipulators design. These obstacles are even more important when the target of microgripping is biological cells. Even though a variety of designs and solutions has been proposed in the literature, the problems of temperature at microgripper tip and applied voltage in gripping jaws are still unsolved. In this paper a new...
In this work, we investigate the impact of layout shapes on STI stress. Based on a stress simulator developed by us, we propose analytical models to correlate the STI stress and the layout parameters. Our model is validated by data collected from a commercial 65 nm process. The experimental results prove that the device characteristics predicted by our model closely match the measured data.
Board level solder joint reliability performance during drop test is a critical concern to semiconductor and electronic product manufacturers. In this paper, a new compliant Wafer Level Package technology is proposed which can accommodate the CTE mismatch between the chip and PCB substrate and consequently should be more reliable without the application of underfill. The purpose of this study is to...
This paper discusses the manner in which cinema buildings of the 20th century represent both an important physical record of society, and a challenge in terms of representing a complex range of historical, cultural, economic and physical data sets.The paper provides an overview of visualisation techniques which are appropriate to the subject, and provides a case study taken from the city of Aberdeen...
Gate density is ultimately increased to 2100 kGates/mm2 by pushing the critical design rules without increasing the circuit margin in 45 nm technology. Layout dependences for stress enhanced MOSFET including contact positioning, 2nd neighboring poly effect, and bent diffusion are accurately modeled for the first time. With the constructed design flow, gate length change of -2.8% to +3.6% and Idsat...
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