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Junction temperature is of great importance to safe operating area of IGBT modules. Various information of the IGBT operating state is reflected on electrical characteristics during turn-on transient. A unified extraction method for internal junction temperature via dynamic thermo-sensitive electrical parameters (DTSEP) during turn-on transient is proposed. Two DTSEP, turn-on delay time (tdon) and...
To achieve low write current in high density Spin Transfer Torque Magnetic Random Access Memory (STT-MRAM) arrays, it is important to understand and co-optimize the different kinds of device switching currents, governed by different materials parameters. We demonstrate that double magnetic tunnel junctions (DMTJs) lower the switching current threshold Ic0 by a factor of two when compared to conventional...
Article presents results of study to determine temperature coefficient of voltage of IGBT. Values of temperature coefficient of voltage obtained at different values of collector current in high conductivity state. Conclusions are made on impact of changes in temperature coefficient of voltage with change of collector current of converter operation in AC electric drive.
IGBT modules suffer from ageing due to thermal and power cycling. Bond wire lift-off or solder layer degradation are the known failure mechanisms. For condition monitoring, an estimation of the junction temperature during operation is necessary. For this purpose, an analog measurement board consisting of simple components is presented. The turn-off delay time is evaluated for temperature estimation...
Junction temperature of insulated gate bipolar transistors (IGBTs) plays an important role in power semiconductor devices reliability. However, it is difficult to have direct access to the chip to obtain the junction temperature. This paper provides a new approach to extract the junction temperature by using combined thermo-sensitive electric parameters (TSEPs) during turn-off transient due to the...
The safe and continuous operation of the power switches of the inverter units is vital in assisting the functioning of the inverter units. This paper proposes an algorithm for the condition monitoring and prognosis of wire-bond fault in an IGBT- extensively used power switch in inverter systems. The proposed algorithm employs both on-state collector emitter voltage and collector current in the estimation...
Thermal cycling is one of the main sources of aging and failures in power electronics. A possibility to reduce the stress to semiconductors is to control the amount of losses that occur in the device during operation. This work presents an active thermal controller that aims at reducing the junction temperature variations in the case of variable power profile. The switching frequency of the converter...
Burn-in screening test technology has been an important method to ensure integrated circuits(IC) quality and reliability. But there are many problems remains to be solved during burn-in and accurate junction temperature of IC during burn-in is one of these problems. Leakage currents are rapidly increasing with CMOS IC technology scaling, and this will lead to high junction temperature of IC in burn-in...
Reliability performances of fully self aligned heterojunction bipolar transistors were investigated under high current and voltage stress conditions. We point out in this paper that generation-recombination traps induced by reverse bias stress can be repaired by forward bias. This is possible thanks to high enough device temperature (strong self-heating condition). Low frequency noise measurements...
Nowadays the demand for thermal standards for power LEDs is increasing. On the one hand metrics for fair comparison of competing products are needed, on the other hand, designers of power LED based applications demand reliable and meaningful data for their daily work. Todaypsilas data sheet information does hardly meet any of these requirements. Part I compares the current situation in the LED world...
The increasing need for standardisation of thermal characterisation of LEDS and LED-based products. Manufacturers and end-users alike are crying for fair and useful thermal data, but for different reasons. It goes without saying that the LED-business is growing exponentially, in fact, much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterisation has not...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
Power IC products are still relatively new. The old idea that an IC is limited to only low power applications is giving way as an attack on power functions is being made by the IC industry. The techniques used in the products which are available today are presented and the three basic power IC approaches; the monolithic, chip, the "monobrid" circuit (a few chips), and the IC driver with...
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