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The Cu6Sn5 intermetallic compound is generated at the interface between OSP substrate and Sn-3.5Ag based solder containing small amount of Co or Ni additives. A small fraction of Co or Ni additive is probed in Cu6Sn5-based crystal structure, which occupies the crystal space sites of Cu atoms. The first-principle approach within the density functional theory is employed herein to explore the favorite...
Cu(InGa)(SeS)2 thin films have been prepared using multi source thermal co-evaporation. The incorporation of the volatile chalcogen species Se and S into the films depends on the fluxes of the evaporated species during growth and the relative [Cu]/[In+Ga] and [Ga]/[In+Ga] compositions. The dependence of the relative Se and S incorporation in Cu(InGa)(SeS)2 on the substrate temperature is characterized...
Sustainability issues involving materials processing and manufacturing are still very poorly investigated. This is true in particular for non-energy parts of such systems. Thermodynamics approaches attract an increasing attention due to general applicability and a clear potential to include both quantity and quality aspects of resources utilization, process assessments and metrics selection. One of...
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