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The physical mechanism of fin-shaped tri-gate AlGaN/GaN Metal Insulator Semiconductor High Electron Mobility Transistors (Fin-MISHEMT) with Al2O3 gate oxide is studied with theoretical model derived and TCAD simulation verified. The relationship between its threshold voltage and fin-width is obtained. The theoretical model of the depletion effect of side gates is based on a two-dimensional Poisson...
Owing to outstanding properties of two-dimensional electron gas (2DEG) and GaN-base material, such as high electron mobility and high critical electric field, AlGaN/GaN high electron mobility transistors (HEMTs) have been considered as the next-generation power semiconductor devices with high power conversion efficiency, high switching frequency and high-temperature operation capability. For power...
In this paper, Al2O3 AlGaN/GaN MOS-HEMTs and HEMTs grown on Silicon substrate were successfully simulated. DC and RF characteristics were extracted. The AlGaN/GaN HEMT suffers from high leakage current. In order to solve this problem, a dielectric Al2O3 gate was applied to the device to suppress the high gate leakage current. The innovative MOS-HEMT technique reduces the leakage current.
We investigate Al2O3/AlGaN interface in GaN MOSHEMTs to engineer channel mobility and threshold voltage suitable for power switching applications. Using oxygen-plasma and annealing treatments, we find the optimal window for high mobility and threshold voltage. Next, we discuss the power switching figure of merit of high composition AlGaN based HEMTs and their potential to achieve large threshold voltages...
In this work, the performance of GaN-based MOS-Channel-HEMTs (MOSC-HEMTs) are shown to be greatly improved by a thin ALD-grown AlN interfacial layer inserted between the amorphous Al2O3 gate dielectric and GaN-channel. The single-crystalline AlN interfacial layer effectively blocks oxygen from the GaN surface and avoids the formation of detrimental Ga-O bonds. Frequency-dispersion in C-V characteristics...
AlGaN/GaN MOS-HEMTs on a silicon platform were realized using a CMOS-compatible gold-free process. Process modules commonly used in CMOS were used, including gate stack formation, etching modules, etc. Ron of 3 mΩ.cm2 was obtained. Breakdown voltage VBR of 800 V was achieved, the highest for LGD below 10 µm for AlGaN/GaN/Si MOS-HEMTs fabricated using a gold-free process. The devices could be generally...
Atomic layer deposition (ALD) technique at 300°C was used to prepare an Al2O3 dielectric layer, to form MOS-HFETs. The static (output and transfer) and dynamic (Capacitance-Voltage) characteristics were used for evaluation of investigated devices. From the static characteristic, an increase of the saturation drain current (up to 35%) and extrinsic transconductance (up to 10%) of the MOS-HFETs were...
In this work, enhanced noise and linearity performance in 0.25 μm gate-length AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MISHEMTs) on high-resistivity silicon substrate using atomic-layer-deposited (ALD) Al2O3 as gate dielectric is reported. High current gain cut-off frequency fT above 40 GHz and low minimum noise figure NFmin of ~1.0 dB at 10 GHz were achieved. This...
In this paper, we have studied the effect of systematic downscaling of MOS channel length of the performance of the hybrid GaN MOS-HEMT with numerical simulations. The improvement in on-state conduction, together with concomitant short channel effects, such as Drain Induced Barrier Lowering (DIBL) and velocity saturation, is quantitatively evaluated. A specific on-resistance of 2.1 mΩ-cm2 has been...
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