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IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 4 > 600 - 607
IEEE Transactions on Electron Devices > 2017 > 64 > 12 > 4928 - 4936
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 11 > 3089 - 3098
IEEE Transactions on Semiconductor Manufacturing > 2017 > 30 > 3 > 236 - 242
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 5 > 1669 - 1680
IEEE Transactions on Computer-Aided Design of Integrated Circuits and... > 2017 > 36 > 4 > 628 - 640
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 4 > 485 - 493
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 2-2 > 646 - 653
IEEE Transactions on Electron Devices > 2017 > 64 > 3 > 1246 - 1253
IEEE Electron Device Letters > 2017 > 38 > 2 > 255 - 257
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 1 > 217 - 227
IEEE Electron Device Letters > 2017 > 38 > 1 > 115 - 118
IEEE Magnetics Letters > 2017 > 8 > 1 - 5
IEEE Transactions on Magnetics > 2017 > 53 > 1 > 1 - 6
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 1 > 286 - 293
IEEE Journal of the Electron Devices Society > 2016 > 4 > 6 > 485 - 489
IEEE Transactions on Computer-Aided Design of Integrated Circuits and... > 2016 > 35 > 11 > 1848 - 1861
IEEE Design & Test > 2016 > 33 > 5 > 56 - 64
IEEE Transactions on Nanotechnology > 2016 > 15 > 5 > 810 - 819
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2488 - 2496