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The goal of this work was to find if there is some difference in thermomechanical properties of one- and two-component electrically conductive adhesives. All adhesive used in this study were of an epoxy type filled with silver flakes and all had isotropic electrical conductivity. The storage modulus, loss modulus and tan delta were studied using thermodynamic mechanical analysis carried out by a penetration...
Sr-HA/Glass composites were produced. Phase composition of composites was evaluated. Their physical and mechanical properties were determined. Sintered composites mainly consisted of Sr-HA/β-TCP, or β-TCP/Ca2ZnSi2O7. The composites had porosity up to 4 times those of undoped Sr-HA. Compared to undoped Sr-HA, the Sr-HA/Glass composites had lower biaxial flexural strength and hardness. The Weibull modulus...
The main goal of the study is to explore epoxy composites with a low permittivity and acceptable other properties, especially mechanical properties and dielectric strength, for electric power applications. The influence of filler surface treatment and filler content on mechanical, thermal and dielectric properties of epoxy composites was systematically investigated. Epoxy composites were prepared...
Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced by curing. Thermomechanical analysis allows to distinguish the point when the adhesive is fully cured, it may reveal a difference in mechanical properties after different modifications...
An electronic device cannot perform its designed functions until it is packaged such that it is interconnected with the rest of the system and protected. As an encapsulation material, thermosetting polymers are widely used. It is well known that properties of polymer-based composites like molding compounds are highly affected by the influence of temperature, relative humidity and degree of conversion...
To determine the hardness and elastic modulus of a 560 nm polycrystalline Al thin film deposited on 7059 glass substrate from nanoindentation tests, we design a method to avoid the severe influences of both substrate and pile-up behavior on evaluated results. Firstly, the hardness is calculated by measuring the total projected contact area of residual impression with help of atomic force microscope...
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