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This article describes recent advance in research of reliability of lead-free (SAC 305) ball interconnections between electronic modules and base printed circuit boards. Alternative methods such as finite element method, which is being widely used in simulation software Ansys and by Coffin-Manson's fatigue model. Recent calculations concur to statistic-based evaluation of earlier experiments, which...
Prevalence of portable devices such as netbook led to increased concerns on drop reliability of FBGA. In order to investigate drop reliability, board level drop test according to Jedec is done in assembly and SMT company, whereas system drop test such as netbook drop test is processed in final product company. In general, the lifetime of Jedec board level drop test and the lifetime of system drop...
In this paper, the mechanical performance of solder joints of BGA mounted on flexible printed circuit (FPC) was studied using finite element method (FEM). To optimize the electric components layout during the design, it is necessary to predict the bending reliability of components on FPC. Traditionally, 3-point or 4-point bending are common used to study if the substrate is rigid. In order to simulate...
In this paper, the fine pitch ball grid array (FBGA) assembly with lead free solder was tested under thermal cycling condition. Finite element modeling and simulation was conducted. The microstructure designs of via in pad of substrate and through hole (via) in PCB under the solder joint were simulated. The solder mask definition (SMD) and non-solder mask definition (NSMD) on PCB board side was also...
The solder joint fatigue life of flip chips and ball grid array packages has been extensively studied and published. However, there are only a few published papers available on the solder joint reliability of a non-leaded, surface mounted package such as the MLPQ (Micro Leadframe Quad Package). In this paper, a non linear Darveaux's solder joint fatigue model has been used to predict the fatigue life...
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