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In this paper, the stretchable interconnect is taken as the research object and its reliability has been analyzed by simulations. Polydimethylsiloxanes (PDMS), as a hyper elastic material, is used here as the stretchable interconnect substrate because of their high elastic property and high stretchability. Traditionally, metals are still the best options to realize the interconnections due to good...
Flexible printed circuit (FPC) is extensively used in portable electronic products because of its excellent flexibility and twistability. Compared with rigid boards, FPC usually experiences much larger deformation in its usages. However, most available packaging-components at the moment are rigid, FPC-contained products may cause failures under accidental mechanical conditions, such as drop, bending...
In this paper, the mechanical performance of solder joints of BGA mounted on flexible printed circuit (FPC) was studied using finite element method (FEM). To optimize the electric components layout during the design, it is necessary to predict the bending reliability of components on FPC. Traditionally, 3-point or 4-point bending are common used to study if the substrate is rigid. In order to simulate...
In this present work the finite element method has been used for the simulation models in order to develop tools for the early stages of product design. The objective is to develop simulation models for Flexible Printed Circuits Boards (PCBs) in a flex-rigid concept in the shape of a wrist device to evaluate its critical stress and strain when this device is submitted to thermal loading considering...
Environmental test is widely used to verify the adaptability and reliability of various electronic products in the last decades. The sharp change of temperature and humidity in certain situations could pose a serious reliability issue on the electronic components. This paper presents an experimental study of one kind of plastic substrate based flexible display called STN (super-twisted nematic). The...
This paper is to perform a design optimization of micromachined piezoelectric transducer by maximizing the system exciting sensitivity. The transducer is a membrane-based micromachined transducer with the piezoelectric film to excite the membrane vibrating. In this study, the exciting sensitivity is taken as the optimization objective. Specifically, when fixing the exciting signal, the transducer...
In this paper, a wrist device conception was selected to study the reliability of flexible devices by drop test simulation. In the conception device, all of the components cannot be made flexible immediately. Some of them are still rigid, such as the ball grid array (BGA), the connector, and some other big components like the vibrator. The reliability of the device, where such rigid components are...
Rigid-flexible printed circuit boards (RFPCB) has the advantages of providing not only the flexibility and bendability required by many electronic products, but also the reliability required by the key electronic components. In this study, based on one kind of RFPCB which would be used for a wearable device prototype, the structure optimization was performed by simulations. Through the structural...
With the requirements of miniaturization of the portable consumer electronic products, more and more new materials, fabricating process and technologies are used to make the electronic components flexible, bendable and wearable. Flexible display, as one of the most important components, recently attracts an enormous research interest in industry and university. With the application of these technologies,...
The plastic substrate based display has many advantages in practical applications of electronics, such as portable, flexible, super thin etc. However, its reliability may significantly impact its performance under the specific environmental conditions. Among the environmental factors, the temperature and humidity are two of the most important factors which may affect the performance of the displays...
With the miniaturization of mobile electronic devices, the flexible electronics are being used more and more in the industry, such as the flexible printed circuit (FPC) and flexible displays (Ptchelintsev, 2006). With the products becoming flexible and bendable, the reliability could become a serious issue in some cases if not designed properly. Examples of such concerns are bending and impact reliability...
The plastic substrate based displays have attracted a lot of interest in recent years because of their potential applications in portable electronic devices. Many of them have high brightness, high contrast, and large angle of view, with the flexibility for accommodating different form factors. However, their reliability in practical applications has not been systematically studied. For many plastic...
Plastic substrate based display could potentially be widely used in electronic devices. Although with many advantages, it may potentially fail because of temperature induced stresses, or structural loads, or material damage resulted from the other environment factors in the practical use. On the other hand, as a relatively new display, the material behavior of the plastic substrate based display has...
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