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Analysis using ANSYS software, CSP component was reduced to two-dimensional model. In the thermal cyclic loading conditions using finite element simulating the stress and strain distribution of CSP components, obtained a dangerous solder joint of structural failure. The number of failure cycles about dangerous solder joint was predicted. Finally, introduced several analysis and evaluation method for...
Wafer level Chip Scale Package (WLCSP) fulfills the demand for small, light, and portable handheld electronic devices, and it is one of the most advanced packaging concepts. When the WLCSP was assembled on board level, the connection, i.e. solder joints are generally the critical and challenging issue for the whole device's reliability. In addition to the shape and material of solder joints, the material...
The fan-out-type chip scale package (fan-out CSP) is an embedded chip packaging technology that eliminates the need for wirebonds and flip-chip bumps. In this study, the board-level reliability of fan-out CSP is studied by using three-dimensional finite element analysis. A design of simulations study is applied to investigate the influences of package geometry on the board-level interconnect reliability...
Along with electronic products developing toward lighter, thinner, and multi-functional integration, chip scale package (CSP) has been widely used in electronic packages. Wafer level packaging (WLP) has become one dominant technology. However, applications of WLP are limited by solder joint fatigue due to stress generated by the CTE mismatch among different materials. Compliant wafer level packaging...
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