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The major purpose of the mechanical stress screening is to screen out the products which have potential defects which lie in materials, design, process, and operation etc. If the screening is thorough before the products are shipped, the rate of the abnormal failure at the users' side can be eliminated or lowered significantly. The manufacturing lot which goes through appropriate screening will have...
Prevalence of portable devices such as netbook led to increased concerns on drop reliability of FBGA. In order to investigate drop reliability, board level drop test according to Jedec is done in assembly and SMT company, whereas system drop test such as netbook drop test is processed in final product company. In general, the lifetime of Jedec board level drop test and the lifetime of system drop...
This study presents a method to predict lifetime of SMD lead free solder joints submitted to vibrations. An experimental method is presented to test chip resistors under vibrations. A specially designed testboard allows testing several specimens simultaneously. The time to failure is electrically detected. The experimental method is simulated using the Finite Element Method (FEM) in order to correlate...
Drop performance for fine-pitch ball grid array (FBGA) assembly is one important issue because FBGA is widely used in handheld electronic products in which the solder joints are prone to failure when subjected to drop impact load during application. It is necessary to assess and improve the FBGA solder joint drop performance during design and engineering stage. The drop impact life model is needed...
In this paper we discuss the lifetime prediction for Pb-free soldered flip chip components under combined temperature cycling (TC) and vibration loading in terms of the failure mechanisms related to solder joint fatigue. We show the results of several experiments including failure analysis and comparison of lifetime models. For this purpose finite element analyses (FEA) of the thermal cycling and...
Most accelerated temperature cycling (ATC) tests reported the observations that SnAgCu (SAC) solders have better thermal fatigue reliability than SnPb solders due to their lower creep strain rate. But material studies revealed that this is true only when stress level is below a certain level. When the stress level in the solder increases, eventually the creep strain rate of SAC solder may outgrow...
Interconnect reliability of Micro BGA in enterprise and portable electronics were studied. Two Micro BGA with similar dimension but different alloy compositions were used in the life testing to observe crack propagation mechanism under thermal cycling stress. Standard metallurgical x-section, dye penetration and SEM were performed at time zero as well as after thermal cycling on 1st pass Micro BGA-solder-PCB...
Solder joint crack is a common failure mode of printed circuit board assembly (PCBA) for electronic products. In order to investigate the crack behavior of fine-pitch SMT solder joints, accelerated thermal cycling (ATC) up to 1500 cycles was performed on advanced PCBAs with low-profile thin small outline package (TSOP). The functional examination result shows that the failure rate of TSOP solder joint...
CBGA (ceramic ball grid array) is one kind of advanced package for FPGA, which can fulfill the demands of high interconnect density, high thermal and electronic performance, high chip-assembling yields, high reliability. But in multiple loading environments, CBGA has the invalidation mode of solder joint thermal-mechanical failure, which will influence the long term reliability of FPGA circuits. But...
Continuous increase in demand for product miniaturization, high package density, high performance and integration of different functional chips has lead to the development of three dimensional packaging technologies. Face-to-face silicon (Si) dies stacking is one of the three dimensional (3D) packaging technologies to form a high density module. In this work, a chip level stacked module was demonstrated...
Due to the advantages of small-footprint, short-lead, high performance, high-packaging-density and thin profile, flip-chip-on-board (FCOB) technology is becoming an attractive choice in todaypsilas high density electronic packaging industry. With the trend toward lead-free and miniaturization in consumer electronics, the fatigue reliability of the small size lead-free FC solder joint on low cost PCB...
Future analysis tools that predict the behavior of electronic components, both during qualification testing and in-service lifetime assessment, will be very important in predicting product reliability and identifying when to undertake maintenance. This paper will discuss some of these techniques and illustrate these with examples. The paper will also discuss future challenges for these techniques.
For pt. 1 see ibid., p.681-94, (2007). In Part 1, a novel two-dimensional model was presented for multi-axial thermal stresses, elastic strains, creep strains, and creep energy density at the interfaces of solder joints in leadless chip resistor (LCR) assemblies. In this paper, the model is used to characterize the creep performance of SnPb and SAC lead-free solder joints in LCRs. For both the SAC...
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