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The requirements for next-generation power electronic modules and devices imply enhanced energy densities, i.e., interconnection packaging technologies have to guarantee enhanced ampacity and robustness with respect to thermo-mechanical loads. Particularly, the interconnection layers of semi-conductor devices (e.g. MOSFET, IGBT, diodes) play a predominant role in the robustness of power electronic...
This study presents a method to predict lifetime of SMD lead free solder joints submitted to vibrations. An experimental method is presented to test chip resistors under vibrations. A specially designed testboard allows testing several specimens simultaneously. The time to failure is electrically detected. The experimental method is simulated using the Finite Element Method (FEM) in order to correlate...
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