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Board level drop test and thermal cycle are the keys qualification tests to ensure the solder joint reliability. It becomes critical due to leadfree solder. The work reported here explores the effect of underfill on drop test and thermal cycle reliability of area array packages, such as BGA's, CSP's, and WLCSP's. An unfilled underfill was found to provide superior drop test performance. Silica filled...
Flexible printed circuit (FPC) is extensively used in portable electronic products because of its excellent flexibility and twistability. Compared with rigid boards, FPC usually experiences much larger deformation in its usages. However, most available packaging-components at the moment are rigid, FPC-contained products may cause failures under accidental mechanical conditions, such as drop, bending...
A complete halogen-free test vehicle was achieved by assembling five ball grid array (BGA) components with daisy-chain on an 8-layer high density interconnection (HDI) printed circuit board with a low-halide Sn1.0Ag0.5Cu (SAC105) Pb-free solder pastes for reducing the formation of Ag3Sn. Afterward a board-level cyclic bending test was enforced on the as-reflowed assemblies according to the JESD22-B113...
The board-level reliability of a 6-layer polyimide-based coreless flip chip package assembled on a printed circuit board (PCB) under a temperature cycling condition of -55 ~ 125??C was investigated in this study. The assembly of coreless flip chip package was achieved by a 17 mm ?? 17 mm die with 4355 Sn37Pb solder bumps, an amine-based underfill and 1521 Sn3.0Ag0.5Cu solder balls, no defect such...
In this paper, the mechanical performance of solder joints of BGA mounted on flexible printed circuit (FPC) was studied using finite element method (FEM). To optimize the electric components layout during the design, it is necessary to predict the bending reliability of components on FPC. Traditionally, 3-point or 4-point bending are common used to study if the substrate is rigid. In order to simulate...
CBGA (ceramic ball grid array) is one kind of advanced package for FPGA, which can fulfill the demands of high interconnect density, high thermal and electronic performance, high chip-assembling yields, high reliability. But in multiple loading environments, CBGA has the invalidation mode of solder joint thermal-mechanical failure, which will influence the long term reliability of FPGA circuits. But...
In this paper, a wrist device conception was selected to study the reliability of flexible devices by drop test simulation. In the conception device, all of the components cannot be made flexible immediately. Some of them are still rigid, such as the ball grid array (BGA), the connector, and some other big components like the vibrator. The reliability of the device, where such rigid components are...
4-point dynamic bending tests of board level electronic packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data. A parameter study was subsequently implemented. The...
This paper deals with the functional reliability study of a new 16 A - 600 V high-temperature TRIAC family, subjected to power cycles, simulating the component in harsh real operation conditions. The targeted application is a vacuum cleaner (1800 W - 230 V - 50 Hz). In this kind of application, one of the major issues for TRIAC, which leads to high mechanical stresses for the assembly, occurs when...
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