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3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. The complexity of the interconnection structures, combined with the reduced thermal spreading in the thinned dies and the poorly thermally conductive adhesives complicate the thermal behavior of a stacked die structure. The same dissipation will lead to higher temperatures and a...
3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. Key technologies for realizing 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnections. The major bottleneck for 3D integration are thermal management issues due to the reduced thermal spreading in...
Telecommunication equipment with high power density and high power consumption should be cooled sufficiently enough for its stable operation and reliability. For the thermal management of a high power telecommunication system, electronic components temperature field and cooling air flow field are simulated by a CFD program. Two levels of thermal modeling are applied due to both computational cost...
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