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3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. The complexity of the interconnection structures, combined with the reduced thermal spreading in the thinned dies and the poorly thermally conductive adhesives complicate the thermal behavior of a stacked die structure. The same dissipation will lead to higher temperatures and a...
We determined the thermal properties of thermal interface materials (TIMs) based on carbon nanotubes (CNTs) and commercial TIMs. The thermal conductivity of different fillers such as CNTs, graphite, nano-diamond, metal, and metal oxide particles (copper and zinc oxide) at different concentrations were studied with a transient plane source technique. For measuring the thermal diffusivity with the Xenon...
Nowadays the demand for thermal standards for power LEDs is increasing. On the one hand metrics for fair comparison of competing products are needed; on the other hand, designers of power LED-based applications demand reliable and meaningful data for their daily work. Today's data sheet information does hardly meet any of these requirements. In earlier papers we compared the current situation in the...
A study was initiated in order to thermally quantify the characteristics of package-on-package (POP), which has been deployed in multiple mobile devices in order to reduce board area and subsequently mobile device size. In most POP scenarios, the memory package is stacked on top of a baseband or application processor and reflowed together. Thermal simulations were conducted for a POP package configuration...
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